TMM-108-01-S-S

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The TMM-108-01-S-S is a rectangular connector for headers, male pins manufactured by Samtec. This connector is designed for high-speed data and power applications, such as data and telecommunications or signal processing applications. The connector can be used in various industries including consumer electronics, broadcasting, automotive, aerospace, industrial, military, and medical fields.

The TMM-108-01-S-S has a male pin design, meaning that the connection is keyed and the connection is only possible when the pins are correctly configured. The pins feature a 1.1mm pitch, .7mm pin size and 12.7mm stack height. The connector has an operating temperature range of -40 to +85°C.

The design of the TMM-108-01-S-S offers an array of features that make it suitable for applications requiring high-speed data and power. The connector has a double-sided contact structure, meaning that there are contacts on each side of the contact interface. This double-sided contact structure provides the ability for electrical connections between the two surfaces, making it ideal for high-speed data and power applications.

The connector utilizes a signal pitch which is the gap between adjacent contacts and it is 1.0mm. This pitch helps to reduce signal propagation time by enabling faster transitions when signals are sent through the connector. It also helps to minimize crosstalk, resulting in better electrical performance. Another benefit of this signal pitch is that it helps the connector to achieve a smaller footprint on the board, making it easier to fit into smaller spaces.

The TMM-108-01-S-S also utilizes an insulation displacement contact (IDC) technology to reduce wiring time and labor costs. IDC technology simplifies the connection of wires from the device to the connector by using insulated wires which can be placed directly into the contact area. By using this technology, the connection time can be shortened, while ensuring the highest level of reliability and performance. Additionally, the TMM-108-01-S-S allows for in-line assembly, allowing for easy installation and removal of the connectors without additional tools or hardware.

The operating system for the TMM-108-01-S-S is an electrostatic shield. This shield provides high electrical insulation and together with the contacts, provides additional protection against EMI/RFI interferences. Additionally, the TMM-108-01-S-S provides excellent signal transmission performance due to its robust construction, which is designed to ensure long-term durability and performance.

The TMM-108-01-S-S offers many advantages when used in high-speed data and power applications. The double-sided contact structure and signal pitch enable faster transitions and minimize crosstalk, while the IDC technology reduces wiring time. Furthermore, the electrostatic shield provides superior protection against EMI/RFI. Thanks to the robust construction and excellent electrical performance, the TMM-108-01-S-S is an ideal choice for applications requiring high-speed data and power.

The specific data is subject to PDF, and the above content is for reference