0097052001 Allicdata Electronics
Allicdata Part #:

0097052001-ND

Manufacturer Part#:

0097052001

Price: $ 16.54
Product Category:

RF/IF and RFID

Manufacturer: Laird Technologies EMI
Short Description: AP,STR,BF
More Detail: N/A
DataSheet: 0097052001 datasheet0097052001 Datasheet/PDF
Quantity: 1000
25 +: $ 15.03710
Stock 1000Can Ship Immediately
$ 16.54
Specifications
Series: --
Part Status: Active
Type: Fingerstock
Shape: --
Width: 0.370" (9.40mm)
Length: 16.000" (406.40mm)
Height: 0.140" (3.56mm)
Material: Beryllium Copper
Attachment Method: Adhesive
Operating Temperature: 121°C
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

RF interference (RFI) and electromagnetic interference (EMI) are two of the most common problems that arise in relation to electrical circuits, as both can cause the circuits to malfunction and can potentially damage sensitive components. In order to control these potential problems, many different technologies have been developed, including contact technology, fingerstock, and gaskets. In this article, we will discuss the application fields and working principles of each type of technology, and how they can be used to help protect against RF and EMI interference.

Contact Technology

Contact technology is a type of electrical shielding that is used to reduce RFI and EMI by providing a conductive barrier between sensitive components and the exterior environment. This type of technology can be used in a variety of ways, including providing contact for ground planes, providing a conductive shield for data and power cables, and providing an effective electrical contact for control systems. Contact technology typically consists of metal contacts, plastic connectors, and conductive gaskets.

To achieve the desired level of shielding, the contact technology must be designed to provide an effective electrical connection between the parts that are being shielded, as well as providing a low-resistance path for any potentially interfering currents. The most common type of contact technology is known as “fingerstock”, which is made up of metal strips that are connected together using screws, rivets, or bolts. Fingerstock is typically placed between two metal plates, and is designed to provide an electrical connection between the two plates, as well as providing an effective shield against any potential RFI or EMI.

Fingerstock

Fingerstock is a type of contact technology that is used to provide an effective electrical connection between two metal plates. The fingerstock is made up of metal strips that are connected together using screws, rivets, or bolts, and is designed to provide an effective shield against any potential RFI or EMI. Fingerstock is typically used in electronic circuit boards, as it can provide a low-resistance path to ground, and provide an effective electrical connection.

Fingerstock is typically composed of copper, silver, or gold, although other metals can also be used for certain applications. Fingerstock is also commonly used in the automotive industry, as it is effective at providing a conductive path between different automotive components.

Gaskets

Gaskets are a type of contact technology that is used to provide an effective seal between two separate components. Gaskets are typically made from a variety of materials, including rubber, cork, plastic, and metal. Gaskets are used to provide a barrier between two metal components, and to prevent any RFI or EMI from entering the system.

Gaskets are typically used in electronics, as they can provide an effective seal between the PCB and the metal chassis. They can also be used in automotive applications, as they can provide an effective seal between the two sections of an engine block, and between the air filter and the engine. Gaskets can also be used to provide an effective shield between radio antennas and other electronic devices.

Conclusion

Contact technology, fingerstock, and gaskets are all technologies that can be used to help reduce RFI and EMI interference. These technologies can be used in a variety of applications, from providing a conductive path between components, to providing an effective shield. Each type of technology has its own unique advantages and disadvantages, and should be chosen based on the application and the level of shielding that is required.

The specific data is subject to PDF, and the above content is for reference

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