02-0503-30 Allicdata Electronics
Allicdata Part #:

02-0503-30-ND

Manufacturer Part#:

02-0503-30

Price: $ 0.64
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN SOCKET SIP 2POS GOLD
More Detail: N/A
DataSheet: 02-0503-30 datasheet02-0503-30 Datasheet/PDF
Quantity: 1000
122 +: $ 0.58120
Stock 1000Can Ship Immediately
$ 0.64
Specifications
Series: 0503
Packaging: Bulk 
Part Status: Active
Type: SIP
Number of Positions or Pins (Grid): 2 (1 x 2)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: --
Termination: Wire Wrap
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA), Nylon, Glass Filled
Operating Temperature: --
Termination Post Length: 0.500" (12.70mm)
Material Flammability Rating: UL94 HB
Current Rating: 3A
Contact Resistance: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Sockets for ICs, Transistors are commonly used in electronics today. They provide the electrical link between an electronic component and the circuit board which controls it. They are available in a variety of shapes and sizes.

These sockets are typically used for inserting, removing, and testing of the ICs and Transistors. They come in a wide range of styles, including single-row, double-row, panel-mount, BGA, and DIP sockets.

Single-row sockets are the most popular type of sockets used for insertion and removal of ICs and Transistors. The main feature of single-row sockets is that all the electrical contacts are arranged in a linear way. They are available in a variety of sizes and shapes, including open-ended, closed-ended, and screened.

Double-row sockets are also commonly used, but they are arranged in such a way that two sets of contacts are placed side-by-side in order to support larger components. Panel-mount sockets are designed to be mounted directly onto a circuit board to facilitate inserting and removing larger components.

BGA (Balled Grid Array) sockets are typically used for connecting fine-pitched components. They feature multiple contacts that are arranged in an array of tiny pits or balls. The advantage of BGA sockets is that they have a higher pin density than other sockets, providing better electrical contact for more reliable data transfer.

DIP (Dual In-line Pin) sockets are typically used for testing ICs and Transistors. These sockets feature a single dual in-line contact arrangement that provides better electrical connection while testing. Additionally, they are easier to use than BGA sockets as they require less soldering.

The use of sockets for ICs and Transistors is an important part of the electronics industry. They can be used to easily and quickly insert, remove, or test these components. By providing reliable electric contact between the component and the circuit board, sockets help ensure that the signals and data are correctly transmitted.

The working principle of the sockets for ICs and Transistors is based on the electric contact created between the socket and component. The socket typically consists of a mounting section, with multiple contacts arranged in a linear, array, or dual in-line arrangement. When the component is inserted into the socket, these contacts create an electrical connection between the socket and the component, thus allowing signals to be transmitted.

In conclusion, sockets for ICs and Transistors are widely used in the electronics industry. They are available in a variety of designs, sizes, and shapes, allowing for easy and efficient testing and insertion of these components. Furthermore, their working principle is based on the electric contact created between the socket and the component, thus making them an important part of the electronics industry.

The specific data is subject to PDF, and the above content is for reference

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