04-0513-10T Allicdata Electronics
Allicdata Part #:

04-0513-10T-ND

Manufacturer Part#:

04-0513-10T

Price: $ 0.39
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN SOCKET SIP 4POS GOLD
More Detail: N/A
DataSheet: 04-0513-10T datasheet04-0513-10T Datasheet/PDF
Quantity: 1000
209 +: $ 0.35533
Stock 1000Can Ship Immediately
$ 0.39
Specifications
Series: 0513
Packaging: Bulk 
Part Status: Active
Type: SIP
Number of Positions or Pins (Grid): 4 (1 x 4)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: --
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: --
Termination Post Length: 0.125" (3.18mm)
Material Flammability Rating: UL94 V-0
Current Rating: 3A
Contact Resistance: --
Description

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Sockets for ICs, Transistors

Sockets for ICs and Transistors are essential components in today’s electronic applications. They can help engineers achieve superior reliability and performance in their projects, because the sockets provide an interface between a printed circuit board (PCB) and the IC or transistor packages. Below are some of the advantages of using interface sockets.

The Advantages of Using Interface Sockets

  • Eliminate damage to IC or transistor packages by reducing mechanical load on them.
  • Reduce wear and tear of IC or transistor packages due to frequent removal and insertion.
  • Protect the IC or transistor from adverse environmental conditions.
  • Increase system reliability by avoiding contact oxidation.
  • Reduce processing costs by reducing the need for labor intensive soldering and de-soldering procedures.

04-0513-10T Application Field and Working Principle

The 04-0513-10T socket is a high quality device designed to plug in IC and transistor devices. It is designed with a BGA (ball grid array) layout and has a pitch of 0.65 mm. This makes it suitable for use in high-density PCB applications such as medical electronics, military and aerospace systems.

The core principle behind the operation of the 04-0513-10T socket is that it provides a stable electrical and physical connection between the high-density PCB and the IC or transistor device. With this socket, the IC or transistor package is held securely by a housing, while contacts on the socket make electrical contact with the pins on the package. This ensures that the package remains in place during operation and is protected from environment-related issues such as dust, dirt and moisture.

The 04-0513-10T socket also provides a robust connection between the high-density PCB and the IC or transistor device due to its gold-plated contacts and low contact resistance. This ensures high transfer speeds and superior signal integrity. Furthermore, the socket includes a moving mechanism which allows the socket to be mounted in different orientations and heights, thus providing additional flexibility.

Conclusion

In conclusion, the 04-0513-10T socket is a highly reliable and high-performance interface socket for IC and transistor devices. Its gold-plated contacts provide robust contact between the socket and the device, while its moving mechanism allows flexible mounting. These features make the 04-0513-10T socket perfect for high-density PCB applications such as medical electronics, military and aerospace systems.

The specific data is subject to PDF, and the above content is for reference

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