Allicdata Part #: | 06-0503-21-ND |
Manufacturer Part#: |
06-0503-21 |
Price: | $ 3.00 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Aries Electronics |
Short Description: | CONN SOCKET SIP 6POS GOLD |
More Detail: | N/A |
DataSheet: | 06-0503-21 Datasheet/PDF |
Quantity: | 1000 |
27 +: | $ 2.72160 |
Termination: | Wire Wrap |
Contact Resistance: | -- |
Current Rating: | 3A |
Material Flammability Rating: | UL94 HB |
Termination Post Length: | 0.360" (9.14mm) |
Operating Temperature: | -- |
Housing Material: | Polyamide (PA), Nylon, Glass Filled |
Contact Material - Post: | Brass |
Contact Finish Thickness - Post: | 10.0µin (0.25µm) |
Contact Finish - Post: | Gold |
Pitch - Post: | 0.100" (2.54mm) |
Series: | 0503 |
Features: | -- |
Mounting Type: | Through Hole |
Contact Material - Mating: | Beryllium Copper |
Contact Finish Thickness - Mating: | 30.0µin (0.76µm) |
Contact Finish - Mating: | Gold |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions or Pins (Grid): | 6 (1 x 6) |
Type: | SIP |
Part Status: | Active |
Packaging: | Bulk |
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Sockets for ICs, Transistors
Sockets for ICs and transistors, sometimes referenced to as IC and transistor sockets, are devices that provide an electrical connection between the IC or transistor and the circuit assembly. Their function is to securely mount or position the IC or transistor in its designated place and also to act as a connector between the IC or transistor and the circuit itself. These devices are most commonly used in high-volume production and prototyping applications.
An IC or transistor socket is an electrical interface that provides physical and electrical connection between a printed circuit board (PCB) and the IC and/or transistor components being mounted on it. It acts as a platform for positioning the IC or transistor during the assembly process. It also provides a reliable and repeatable electrical connection by providing secure contact between each contact pin of the IC or transistor and the corresponding contact pad on the PCB. The socket can be mounted in either a through-hole or surface mount configuration. The size, style, and form factor of the circuit board and IC or transistor components will dictate the socket design utilized.
The most common types of IC and transistor sockets available are surface mount (SMT) and through-hole (THT) sockets. These sockets can be used for various types of devices such as standard DIP, SOIC, PLCC, and QFP devices. SMT sockets are smaller and have a low profile, making them ideal for high-density circuit boards, whereas THT sockets provide a more secure connection, making them well-suited for large-sized ICs and transistors. These sockets are typically made from thermoplastic material such as polypropylene or polyethylene.
The working principle of an IC or transistor socket is simple. It consists of a row of pins on one side and a row of contact pads on the other, each connecting to one of the pins on the IC or transistor. When the IC or transistor is placed in the socket, the pins are lined up with the contact pads on the PCB, which allows an electrical connection to be made. This electrical connection is then maintained by the spring force of the socket, which ensures that the pins remain securely in contact with the contact pads.
The advantages of utilizing IC and transistor sockets in a circuit assembly include: reduced assembly costs, improved reliability and repeatability, and easier reworking or replacement of the components. The bottom line is that these socket devices provide the electrical connection interface and simplify the assembly process.
In summary, IC and transistor sockets are devices that provide an electrical connection between a printed circuit board and the ICs and/or transistors mounted on it. They act as a platform for positioning the components during assembly, and also provide a reliable electrical connection between the contact pins and contact pads. These sockets are available in either surface mount or through-hole configurations and can be used for various types of devices such as DIP, SOIC, PLCC, or QFP devices. They provide several advantages, including reduced assembly costs, improved reliability and repeatability, and easier reworking or replacement of components.
The specific data is subject to PDF, and the above content is for reference
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