06-1518-10T Allicdata Electronics
Allicdata Part #:

06-1518-10T-ND

Manufacturer Part#:

06-1518-10T

Price: $ 0.48
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN IC DIP SOCKET 6POS GOLD
More Detail: N/A
DataSheet: 06-1518-10T datasheet06-1518-10T Datasheet/PDF
Quantity: 1000
167 +: $ 0.42527
Stock 1000Can Ship Immediately
$ 0.48
Specifications
Series: 518
Packaging: Bulk 
Part Status: Active
Type: DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid): 6 (2 x 3)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: --
Termination Post Length: 0.125" (3.18mm)
Material Flammability Rating: UL94 V-0
Current Rating: 3A
Contact Resistance: --
Description

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Sockets for ICs, Transistors

As devices become increasingly integrated, sockets for integrated circuits (ICs), transistors, and other components are becoming more important in many application fields. Understanding the working principles of these components is essential for effective design and implementation. This article provides an overview of the common application fields and the working principles of sockets for ICs, transistors, and other components.Sockets for integrated circuits, transistors, and other components are primarily used in communication, databases, automotive, and energy systems. In communication systems, these sockets are typically used to optimize performance, reduce size, and extend communication reach between components. In databases, these sockets are typically used to connect to external data sources, store large data sets, and manage communication protocols. In automotive applications, such sockets are used to control the operation of electrical systems such as airbags, automatic starting, climate control, and driveline systems. Finally, in energy systems, these sockets are necessary for connecting multiple energy sources in order to achieve efficient energy transfer.The working principles of sockets for ICs, transistors, and other components can be divided into two groups: active and passive. In active sockets, an electrical current is sent to the component, and the component responds with its own signal. This type of socket is often used in communication systems and data processing systems, as it allows for a faster data transfer rate. Passive sockets, on the other hand, do not require electricity in order to function. They are commonly used in energy systems, as they allow for efficient energy transfer with minimal electrical resistance.In addition to their application fields and working principles, sockets for ICs, transistors, and other components come in different shapes and sizes. The types of sockets used depend on the application and the size of the component. For instance, the double-row dual-in-line socket type is often used for large components, while the single-row DIP socket type is often used for smaller components. Additionally, many sockets are designed to fit specific components, such as memory chips and surface-mount devices.Finally, sockets can also be categorized according to their mounting type. Through hole mounting sockets, for example, are typically used to mount larger components, while surface mount sockets are used for smaller components. In addition, there are also adapters, such as DMA adapter sockets, which allow for better control and faster data transfer rate in communication systems.In conclusion, sockets for ICs, transistors, and other components are essential in many application fields. The application fields and working principles of these sockets vary depending on the size and type of the component they are being used with. Additionally, sockets come in different shapes and sizes, and are categorized according to their mounting type. Through proper understanding and implementation of these components, engineers can optimize performance, reduce size, and extend communication reach between components more effectively.

The specific data is subject to PDF, and the above content is for reference

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