06-3508-20

Termination:	Wire Wrap
Contact Resistance:	--
Current Rating:	3A
Material Flammability Rating:	UL94 V-0
Termination Post Length:	0.360" (9.14mm)
Operating Temperature:	-55°C ~ 105°C
Housing Material:	Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Material - Post:	Brass
Contact Finish Thickness - Post:	200.0µin (5.08µm)
Contact Finish - Post:	Tin
Pitch - Post:	0.100" (2.54mm)
Series:	508
Features:	Open Frame
Mounting Type:	Through Hole
Contact Material - Mating:	Beryllium Copper
Contact Finish Thickness - Mating:	30.0µin (0.76µm)
Contact Finish - Mating:	Gold
Pitch - Mating:	0.100" (2.54mm)
Number of Positions or Pins (Grid):	6 (2 x 3)
Type:	DIP, 0.3" (7.62mm) Row Spacing
Part Status:	Active
Packaging:	Bulk

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Sockets for ICs, Transistors

Sockets for ICs and transistors are specialized tools designed to allow chips and transistors to be easily connected to an electronic circuit. They are used in a wide variety of applications, from data processing and telecommunication systems to medical equipment and consumer electronics. This article will cover the application field of 06-3508-20 sockets and their working principles.06-3508-20 sockets are a type of interposer socket commonly used in telecommunication, printed circuit board (PCB) design, and medical equipment. The 06-3508-20 socket is designed to fit a specific lead count and pitch to accommodate a wide range of Integrated Circuits (ICs), including small outline integrated circuits (SOICs), dual in-line packages (DIPs), quad flat packages (QFPs), and ball grid arrays (BGA). The 06-3508-20 sockets are widely used because they offer high reliability, low insertion force, and excellent thermal performance.The working principle of 06-3508-20 sockets is based on an interposer technology, which was developed to address the need for high-performance interconnection with both high-density and low-cost components. With interposer technology, an intermediate layer of insulating material such as polyimide is placed between the components and the socket, creating an insulation gap. This gap allows for more efficient heat transfer, and it also allows the socket to adapt to any solder ball size, pitch, height, and configuration. As a result, 06-3508-20 sockets are able to accommodate a variety of ICs and transistors with different lead counts, lead pitches, and body shapes.The 06-3508-20 socket is also designed to provide excellent electrical connectivity and high-temperature stability. Its gold-plated contacts ensure a reliable connection with the IC. Its low-profile design allows for easy access to the leads during assembly. Additionally, the socket\'s integral spring clips provide a secure connection with the PCB and its wire leads.The 06-3508-20 socket is an ideal tool for any application that requires the reliable and efficient connection of ICs and transistors. Its wide range of features and advantages make it an ideal choice for a range of applications, including medical, data processing, telecommunication, automotive, and consumer electronics. Its superior thermal performance, low insertion force, and high-density contact system make it an ideal choice for any high-performance application.

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