06-71187-10 Allicdata Electronics
Allicdata Part #:

06-71187-10-ND

Manufacturer Part#:

06-71187-10

Price: $ 5.10
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN SOCKET SIP 6POS TIN
More Detail: N/A
DataSheet: 06-71187-10 datasheet06-71187-10 Datasheet/PDF
Quantity: 1000
15 +: $ 4.63050
Stock 1000Can Ship Immediately
$ 5.1
Specifications
Series: 700 Elevator Strip-Line™
Packaging: Bulk 
Part Status: Active
Type: SIP
Number of Positions or Pins (Grid): 6 (1 x 6)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 200.0µin (5.08µm)
Contact Material - Mating: Phosphor Bronze
Mounting Type: Through Hole
Features: Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Material - Post: Phosphor Bronze
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C
Termination Post Length: 0.150" (3.81mm)
Material Flammability Rating: UL94 V-0
Current Rating: 1.5A
Contact Resistance: --
Description

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Sockets for ICs, Transistors

The 06-71187-10 compact socket is designed for use with integrated circuits (ICs) and transistors. This solidly constructed socket is made of high-quality materials for utmost reliability and durability and is designed with extra strength for use with 14-pin, 16-pin, 20-pin and 22-pin packages. Its terminals have a current rating of 1A/21Vdc.

This type of socket facilitates the connection of transistors and ICs to a circuit board. The device works with a flat printed circuit board (PCB) and has a standard spacing of 0.1 inch (2.54mm). The socket is provided with two mounting clips on each side and on its front and back surface. It has two poles of equal length on the front side to facilitate the connection of ICs and transistors. The front and back contacts are made of gold plated copper alloy to ensure excellent electrical performance.

The 06-71187-10 has a standard pin projection height of 0.5 inches (13mm) and a contact pressure of 0.012 inch (3mm). It requires no tools or soldering for installation and is suitable for circuit boards with a thickness of 1.6mm. The socket is designed with a rugged frame with an open design providing better accessibility to the components. Its compact size makes it perfect for densely populated circuit boards.

The pin projections of the socket are integrated to ensure reliable connections between the board and the components. The contact eyelet is formed with precision for better contact between the components and the board, providing reliable connections and enabling users to troubleshoot faults quickly.

The 06-71187-10 also has an integral grounding surface to ensure consistent grounding. This helps to keep noise and interference levels to a minimum and ensures a reliable and stable connection. The socket is designed to work with a wide range of components, including narrow-pitch devices, SMT footprints, and large-pitch ICs.

The socket is designed to be highly reliable and durable. It is made of durable materials to withstand harsh operating conditions and robust electrical usage. It can be easily installed and removed when needed without any soldering or other tools. The socket is also corrosion-resistant and has excellent temperature and vibration performance.

The 06-71187-10 is designed for use in a wide range of applications, including computer and communication equipment, instrumentation, consumer electronics, and automotive circuits. The socket is ideal for prototyping and testing new designs and for replacing faulty components in existing circuits. The socket is also compatible with a range of PCBs, including conventional boards and flexible circuits.

Overall, the 06-71187-10 is designed to ensure reliable and robust connections between ICs and transistors, and a circuit board. Its rugged construction ensures high-performance and reliable operation in demanding applications, making it an ideal choice for various circuit boards and applications.

The specific data is subject to PDF, and the above content is for reference

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