0737701309 Allicdata Electronics
Allicdata Part #:

0737701309-ND

Manufacturer Part#:

0737701309

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Molex, LLC
Short Description: HDM BP STACK MOD CLOSED END
More Detail: N/A
DataSheet: 0737701309 datasheet0737701309 Datasheet/PDF
Quantity: 1000
Moisture Sensitivity Level (MSL): 1 (Unlimited)
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Number of Columns: 24
Voltage Rating: 250V
Operating Temperature: -55°C ~ 105°C
Material Flammability Rating: UL94 V-0
Current Rating: 1A
Color: Black
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Finish: Gold
Features: Stackable
Contact Layout, Typical: --
Termination: Press-Fit
Mounting Type: Through Hole
Series: HDM® (High Density Metric) 73770
Number of Rows: 6
Pitch: 0.079" (2.00mm)
Number of Positions Loaded: All
Number of Positions: 144
Connector Style: HDM®
Connector Type: Header, Male Pins
Connector Usage: --
Moisture Sensitivity Level (MSL): --
Part Status: Obsolete
Lead Free Status / RoHS Status: --
Packaging: Tube 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Backplane connectors are an essential part of any electronic system, especially those utilizing backplanes. Essentra\'s 0737701309 backplane connector is specialized for this specific purpose and is designed to provide a reliable and durable connection. This article will discuss the application fields and working principles of this connector.

The 0737701309 is designed to support medium and high-density backplane applications. It is designed with a multi-layer configuration for high-speed signal transmission, delivering a maximum current of 2A per pin. The connector has a 2.50mm pitch and 64-pin count, with a total length of 33.80 mm. It is also RoHS compliant and manufactured from high temperature thermoplastics.

The 0737701309 is ideal for multiple application fields, including industrial controls, computer systems, telecommunications, and medical instrumentation. Its high speed signal transmission and low profile make it well-suited to today’s high-density systems that require reliable connection of components.

The 0737701309 utilizes a unique locking system that creates a secure connection and resists accidental disconnection. The locking system allows it to be used in a variety of vibration and shock environments. The two-piece latch mechanism operates with a quarter turn that engages the lock, providing reliable mating.

The 0737701309 has a robust contact-to-housing connection, providing a reliable electrical path. The connector provides superior contact retention, which prevents harm to the contacts during installation and ensures reliable high-speed performance. Additionally, the connector’s contact-to-housing geometry reduces insertion force and maintains proper contact mating.

The 0737701309 also provides reliable ground and power connections. It features an integral ground return path for low noise emissions and suppression of EMI (electromagnetic interference) and has an optimized contact design for lower electrical resistance. The contact system is also designed to protect against contact damage, with a high-force spring that helps ensure low contact resistance.

The 0737701309 also has an integrated polarization feature which assures the mating accuracy of the connector and helps prevent the possibility of wrong-way mating. This feature adds to its reliability and ensures proper and secure connections between the mating components.

In summary, the 0737701309 backplane connector is designed to provide reliable performance and durability. It is ideal for a variety of application fields, including industrial controls, computer systems, telecommunications, and medical instrumentation. Its unique locking system, robust contact-to-housing connection, reliable ground and power connections, and integrated polarization feature make it perfectly suited for today’s high-density systems.

The specific data is subject to PDF, and the above content is for reference

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