0743001144 Allicdata Electronics
Allicdata Part #:

0743001144-ND

Manufacturer Part#:

0743001144

Price: $ 24.96
Product Category:

Connectors, Interconnects

Manufacturer: Molex, LLC
Short Description: HDM DC STKG MOD GDE OP 14MM
More Detail: N/A
DataSheet: 0743001144 datasheet0743001144 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
120 +: $ 22.68910
Stock 1000Can Ship Immediately
$ 24.96
Specifications
Series: HDM® (High Density Metric) 74300
Packaging: Tube 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Usage: --
Connector Type: Receptacle, Female Sockets
Connector Style: HDM®
Number of Positions: 144
Number of Positions Loaded: All
Pitch: 0.079" (2.00mm)
Number of Rows: 6
Number of Columns: 24
Mounting Type: Through Hole
Termination: Solder
Contact Layout, Typical: --
Features: Mating Guide, Stackable
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Color: Black
Current Rating: 1A
Material Flammability Rating: UL94 V-0
Operating Temperature: -55°C ~ 105°C
Voltage Rating: 250V
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

0743001144 Backplane Connectors are a specialized type of connector that are used for connecting printed circuit boards. These modules are specifically designed for use in high-speed, high-density backplane interconnect systems. The modules are equipped with angled or right-angle card edge contacts to ensure dependable and reliable connections. They provide strong grounding and signal routing between boards.

The 0743001144 Backplane Connectors offer an optimized high-speed, high-density solution from 2 to 11 surface mounting connectors. They feature low-profile housings, ruggedized card-edge contacts and integrated grounding, as well as side-by-side mounting capability. The modules are suitable for use in harsh environments, such as high-power and high-voltage applications. They can easily accommodate up to 20 circuits without any additional hardware.

To ensure maximum performance, the 0743001144 connectors incorporate advanced signal integrity technologies. These include high-ISI elastomers, differential-impedance grounding and shorts-prevention technologies. With their innovative design, they are capable of providing superior EMI-suppression performance, allowing for increased signal-to-noise ratio and improved signal integrity.

The 0743001144 Backplane Connectors feature a dual-row configuration, which provides flexible routing in two directions. This design also reduces the number of PCB points of contact needed to reduce crosstalk. By providing an innovative and flexible solution, the connectors offer high performance, ease of installation and reliable connections.

The working principle of the 0743001144 Backplane Connectors is simple. The module is equipped with angled or right-angle card edge contacts to ensure reliable connections. The card-edge contacts are designed to provide signal routing between cards. The contacts are arranged in a dual-row configuration to allow for flexible routing in two directions. Additionally, the contacts feature high-ISI elastomers to enable reliable signal transmission and are equipped with shorts-prevention technologies to ensure maximum signal integrity.

In summary, the 0743001144 Backplane Connectors are a specialized type of connector for use in high-speed, high-density backplane interconnect systems. The modules feature low-profile housings, ruggedized card-edge contacts as well as integrated grounding. They offer an optimized solution from 2 to 11 surface mounting connectors, and are ideal for harsh environments. The working principle is simple, incorporating signal integrity technologies such as differential-impedance grounding, high-ISI elastomers and shorts-prevention technologies, to ensure maximum performance. Therefore, the 0743001144 Backplane Connectors are a reliable and dependable solution for any high-speed, high-density application.

The specific data is subject to PDF, and the above content is for reference

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