0749801002 Allicdata Electronics
Allicdata Part #:

0749801002-ND

Manufacturer Part#:

0749801002

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Molex, LLC
Short Description: CONN HEADER 40POS 2MM T/H GOLD
More Detail: N/A
DataSheet: 0749801002 datasheet0749801002 Datasheet/PDF
Quantity: 1000
Moisture Sensitivity Level (MSL): 1 (Unlimited)
Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Number of Columns: 10
Voltage Rating: 120V
Operating Temperature: -55°C ~ 105°C
Material Flammability Rating: UL94 V-0
Current Rating: 2A
Color: Black
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Finish: Gold
Features: Shielded
Contact Layout, Typical: --
Termination: Press-Fit
Mounting Type: Through Hole
Series: VHDM-HSD™ 74980
Number of Rows: 4
Pitch: 0.079" (2.00mm)
Number of Positions Loaded: All
Number of Positions: 40
Connector Style: VHDM®, Guide Left
Connector Type: Header, Male Pins
Connector Usage: --
Moisture Sensitivity Level (MSL): --
Part Status: Obsolete
Lead Free Status / RoHS Status: --
Packaging: Tube 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Backplane connectors are specialized components used to terminate data or signal connections between individual printed circuit boards (PCBs) in a backplane or other type systems. Backplane connectors are the vital link found in all types of electronic and electrical systems, ranging from computers and communications equipment to control systems and telemetry applications. The 0749801002 backplane connector is a high-performance, high-density, limited-maintenance board-to-board electrical connector system designed especially for the high-data bandwidth/low latency requirements of today’s embedded computing systems.

The 0749801002 backplane connector consists of four components: a contactor or male tag, a pressure plate, a plastic insulator, and physical interconnect components such as plates, spacers, screws, and nuts. Its physical interconnect components are designed to hold the contactors in place in the pressure plate. Its main components are machined to ensure accuracy and consistency, and it is designed to provide a reliable connection with low insertion force.

The 0749801002 backplane connector is used in many different applications including high-speed data transfer systems, embedded computing systems, test and measurement systems, communications systems, and computer equipment. It is commonly used in embedded computing systems due to its high data rate and low latency performance, as well as its high-density design which allows for more compact system designs. Additionally, it is designed to be highly reliable and cost-effective, while providing a high level of durability and resistance to environmental conditions. Its main characteristics include a Type-C connector interface, a Maximum Data transfer rate of 8.00Gbps, an Insertion force of 5-20 lbs, and an Operating Temperature range of 0°C to +65°C.

The working principle of the 0749801002 backplane connector is based on the simple principle of electrically interconnecting multiple printed circuit boards. When the board and pressure plate are pressed together, electrical contact is made between the contactor and contactor surface. This creates a low impedance connection with the ability to carry high-speed data signals at low latency. The contactor and pressure plate are held together by the plastic insulator which also prevents any unwanted electrical contact, contamination, or wearing of the contactor surface.

The 0749801002 backplane connector is an essential component for embedded computing systems. Its high speed and low latency performance, along with its high-density design, make it an ideal choice for these applications. Its use ensures reliable connections with low insertion forces and reduces the size and cost of the system without compromising performance. It is a robust and cost-effective solution for today’s high-performance embedded computing systems.

The specific data is subject to PDF, and the above content is for reference

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