0761701010

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

0761701010 is a kind of backplane connector that can be used to interconnect both printed circuit board (PCB) and mezzanine boards. It is a specialized product designed to ensure rigid contact and tremendous mechanical strength. Made of high-temperature resistant gold plated phosphor bronze contacts, 0761701010 is suitable for board-to-board connection in order to meet higher requirements for rigid mechanical and electrical contact.

Application Field

The 0761701010 backplane connector is suitable for various applications that require reliable connection between large number of board modules. It is mostly used in server blade architecture and other multi-level board-to-board connection applications, such as high-end storage systems, networking switches, blade server systems, etc. In addition, due to its multiple connection points, the connector can be used to transfer both signal and power in board-to-board connection.

Working Principle

The 0761701010 connector usually consists of a housing and a mating extrusion bar, as well as numerous gold plated phosphor bronze contacts. It has two rows of contacts, each containing 10 pins arranged in a 1 cm pitch. The pins are designed with both side-mounting screws and spring-loaded retention force, ensuring the connector is firmly attached to the circuit board while providing additional strain relief.

In operation, the mating extrusion bar is first connected to the board-level connector. Once the PCBs are connected, mating extrusion bars on the two boards provide rigid connection and ensure that the contact is physically maintained. When the connector is connected, it makes electrical connection with the board-level contact points, guaranteeing electrical continuity and data transmission.

With its high-temperature resistivity, durability and mechanical integrity, the 0761701010 backplane connector can provide reliable connections under tough conditions. In addition, the multiple contact points enable transfer of both signals and power across the contact interface, making it an extremely useful solution for complex board-level architectures.

The specific data is subject to PDF, and the above content is for reference