08-0513-10T

Series:	0513
Packaging:	Bulk
Part Status:	Active
Type:	SIP
Number of Positions or Pins (Grid):	8 (1 x 8)
Pitch - Mating:	0.100" (2.54mm)
Contact Finish - Mating:	Gold
Contact Finish Thickness - Mating:	10.0µin (0.25µm)
Contact Material - Mating:	Beryllium Copper
Mounting Type:	Through Hole
Features:	--
Termination:	Solder
Pitch - Post:	0.100" (2.54mm)
Contact Finish - Post:	Tin
Contact Finish Thickness - Post:	200.0µin (5.08µm)
Contact Material - Post:	Brass
Housing Material:	Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature:	--
Termination Post Length:	0.125" (3.18mm)
Material Flammability Rating:	UL94 V-0
Current Rating:	3A
Contact Resistance:	--

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Introduction

The 08-0513-10T application field and working principle is an important field of research in the field of Sockets for ICs, Transistors. Socket technology is widely used in semiconductor device manufacturing to connect integrated circuits to substrates, providing stable current flow and contact between circuits and substrates. This article will provide an overview of the 08-0513-10T application field and working principle, and will discuss the advantages and disadvantages of this technology.

Application Field

The 08-0513-10T application field can be divided into two parts: firstly, it can be used in the package technology of semiconductor products, and secondly, it can be used in high-speed data transmission.In terms of package technology of semiconductor products, the 08-0513-10T application field is mainly used in the process of packaging and testing of integrated circuits. The socket technology is used to connect the integrated circuit package to the board or substrate, making it easier to test and detect the IC\'s behavior. With the help of the 08-0513-10T application field, it is possible to quickly detect faults in the integrated circuit package, instead of having to find them manually. This can greatly reduce the defects in the packaging process and save time.In terms of high-speed data transmission, the 08-0513-10T application field is mainly used in backplane systems. It is used to provide reliable physical connection between boards, enabling high-speed data exchange and parallel data transmission. The 08-0513-10T application field can provide reliable contact and low signal crosstalk, allowing for the best possible data transmission.

Working Principle

The working principle of the 08-0513-10T application field is based on the principles of contact insertion, contact relief, and contact energizing. This technology is commonly used in semiconductor packaging and testing, as well as in high-speed data transmission.The contact insertion principle is used in the package technology of semiconductor products. In this principle, the socket contact is inserted into the socket of the board or substrate and a signal is sent from the contact. This signal is then used to detect faults in the package.The contact relief principle is used in the high-speed data transmission field. This principle is based on the fact that when the contacts are energized, the spring contact of the socket will slightly adhere to the corresponding substrate, creating reliable electrical contact. This reliable contact is sustained even with high contact pressure, guaranteeing the high speed transmission of data without interference.The contact energizing principle is also used in the high-speed data transmission field. This principle is based on the fact that when the contacts of the socket are energized, the electrical contact between the contact and the substrate becomes a conductive path, making it possible to transfer data without interfering with other components.

Advantages of 08-0513-10T Application Field

The 08-0513-10T application field has a number of advantages:• Low signal crosstalk: The socket design of the 08-0513-10T application field eliminates the crosstalk interference that is often seen with other contact technologies. This ensures reliable data transmission and eliminates the risk of data corruption.• Easy to implement: The 08-0513-10T application field is relatively easy to implement compared to other technologies. All that is required is to insert the contact into the socket, and the connection is established. This is a huge advantage in terms of cost and time efficiency.• Shock-proof: The 08-0513-10T application field is shock-proof, which means that it can withstand mechanical shocks without influencing the contact force of the electrical connection. This allows for a reliable connection even in extreme conditions.

Disadvantages of 08-0513-10T Application Field

The 08-0513-10T application field also has some disadvantages:• Limited number of contacts: The 08-0513-10T application field is limited in the number of contacts that can be used for high speed data transmission.• Cost: The 08-0513-10T application field is more expensive than other contact technologies, due to the materials and labor required to implement it.• Durability: The 08-0513-10T application field is not as durable as other contact technologies, and can be susceptible to wear and tear over time.

Conclusion

The 08-0513-10T application field is an important field of research in the field of sockets for ICs, transistors. It is widely used in semiconductor device manufacturing for package technology and high-speed data transmission. The socket technology is based on the principles of contact insertion, contact relief, and contact energizing, and has a number of advantages such as low signal crosstalk, easy implementation, and shock proof. However, there are some disadvantages such as a limited contact number, cost, and durability.

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