08-1508-30

Series:	508
Packaging:	Bulk
Part Status:	Active
Type:	DIP, 0.2" (5.08mm) Row Spacing
Number of Positions or Pins (Grid):	8 (2 x 4)
Pitch - Mating:	0.100" (2.54mm)
Contact Finish - Mating:	Gold
Contact Finish Thickness - Mating:	10.0µin (0.25µm)
Contact Material - Mating:	Beryllium Copper
Mounting Type:	Through Hole
Features:	Closed Frame
Termination:	Wire Wrap
Pitch - Post:	0.100" (2.54mm)
Contact Finish - Post:	Tin
Contact Finish Thickness - Post:	200.0µin (5.08µm)
Contact Material - Post:	Brass
Housing Material:	Polyamide (PA46), Nylon 4/6
Operating Temperature:	-55°C ~ 105°C
Termination Post Length:	0.500" (12.70mm)
Material Flammability Rating:	UL94 V-0
Current Rating:	3A
Contact Resistance:	--

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Sockets for ICs, TransistorsConnectors and sockets are essential components in most electronic circuitry. In electronic systems, these components are used to link two components of a circuit, usually between an integrated circuit (IC) chip and its circuit board, or between transistors. Sockets for ICs and transistors come in a range of sizes and styles, depending on their purpose and the interface requirements for the circuits in which they are used. In most cases, they are designed to attach to a circuit board, breadboard, or similar carrier, and to act as an interface between the IC and external circuitry.Sockets for ICs and transistors are available in various styles, including the most common types such as dual in-line packages (DIPs), surface-mount packages (SMPs), and others. Depending on the system design, some sockets also include additional functionality, such as power distribution, impedance matching, or signal conditioning.The main purpose of a socket is to provide mechanical support for an IC, as well as allowing electrical connections to the IC. To do this, the socket must be firmly affixed to a circuit board. This is usually achieved by first mounting the socket to the board, and then attaching the IC to the socket. The socket may also include features such as spring-loaded connections, which are used to securely attach each leg of the IC to its respective pin.The use of sockets for ICs and transistors has several advantages. For instance, since the IC is protected by the socket, there is less need to solder or otherwise physically attach the IC to the board. This reduces assembly time and cost, and makes it easier to replace an IC should it fail.Sockets also provide improved signal integrity, as they allow for impedance matching between the IC and the external circuit. In addition, sockets can improve the physical robustness of the circuit, as they provide mechanical support for the IC. This is especially important in systems that are subject to vibrations or shock. Sockets used for ICs and transistors are usually constructed from plastic or metal material, depending on their intended use. Common materials include Delrin and PEEK, both of which are relatively low-cost yet highly reliable for IC and transistor applications.In recent years, the high demand for low-power applications has driven the development of new socket technologies, such as traceability and auto-settle, which allow for improved reliability and higher performance. Traceability enables the socket to communicate directly with the IC, allowing the system to identify when a device is inserted or removed. Auto-settle, on the other hand, allows the socket to automatically adjust its internal connections for optimum performance and reliability. Finally, as technology advances, so do the materials used for sockets. For example, the move toward smaller and more sophisticated systems has increased the demand for advanced materials, such as gold-plated contacts, which provide improved signal quality and increased reliability. Overall, sockets for ICs and transistors are essential components in many electronic systems. When properly designed and selected, these components can significantly improve the performance of a system, as well as provide increased flexibility for assembly and repair. With the proper use of sockets, many of the challenges associated with IC and transistor applications can be eliminated.

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