Allicdata Part #: | 08-7360-10-ND |
Manufacturer Part#: |
08-7360-10 |
Price: | $ 3.92 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Aries Electronics |
Short Description: | CONN SOCKET SIP 8POS TIN |
More Detail: | N/A |
DataSheet: | 08-7360-10 Datasheet/PDF |
Quantity: | 1000 |
30 +: | $ 3.55887 |
Series: | 700 Elevator Strip-Line™ |
Packaging: | Bulk |
Part Status: | Active |
Type: | SIP |
Number of Positions or Pins (Grid): | 8 (1 x 8) |
Pitch - Mating: | 0.100" (2.54mm) |
Contact Finish - Mating: | Tin |
Contact Finish Thickness - Mating: | 200.0µin (5.08µm) |
Contact Material - Mating: | Phosphor Bronze |
Mounting Type: | Through Hole |
Features: | Elevated |
Termination: | Solder |
Pitch - Post: | 0.100" (2.54mm) |
Contact Finish - Post: | Tin |
Contact Finish Thickness - Post: | 200.0µin (5.08µm) |
Contact Material - Post: | Phosphor Bronze |
Housing Material: | Polyamide (PA46), Nylon 4/6, Glass Filled |
Operating Temperature: | -55°C ~ 105°C |
Termination Post Length: | 0.150" (3.81mm) |
Material Flammability Rating: | UL94 V-0 |
Current Rating: | 1.5A |
Contact Resistance: | -- |
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Sockets for ICs, transistors, and other components are an essential tool in the manufacture of electronics today, not just for the assembly of boards and circuits, but also for testing and validation processes. The 08-7360-10 Socket from JST is an example of a modern socket that has been designed specifically to accommodate various types of integrated circuits (ICs) and other components. This article provides a closer look at the application field and working principle behind this particular socket.
Applications
The 08-7360-10 Socket from JST is designed to work with ICs in a variety of application fields. It is suitable for use in memory modules, microprocessors, DSPs, digital signal controllers, electro-mechanical components, and much more. It features an innovative, ergonomic design which allows for easy access and placement of the ICs in the socket. This makes it ideal for both prototyping as well as mass production.
The socket is also designed to be highly reliable and to provide a stable environment for the insertion of the ICs. It features a special, low-resistance structure that minimizes the risk of damage to the ICs during assembly and de-assembly. This allows for a more efficient integration of the ICs into the final application.
Working Principle
The 08-7360-10 Socket from JST utilizes a unique socket-pin contact technology. It features spring-loaded, metal-backed IC pins. As the IC is inserted into the socket, the pins are compressed against the IC’s contact pad. This creates an electrical connection between the pins and the contact pads, ensuring a tight contact fit. This secure connection provides a more reliable environment for protection of the ICs from external shocks, vibrations and electrical interference.
In addition, the contacts on the 08-7360-10 Socket from JST feature a special, low-resistance design. This helps to reduce the amount of contact resistance, which can lead to electrical and thermal problems. The pins are also designed to ensure a uniform contact force across the surface of the IC, allowing for a more efficient mating process.
Another beneficial feature of the 08-7360-10 Socket from JST is its thermal dissipation design. The socket utilizes an advanced heat sink technology, which helps to effectively dissipate the heat generated by the ICs during use. This ensures that the contact points remain cooler and that the ICs remain safe and secure during assembly.
Conclusion
The 08-7360-10 Socket from JST is designed to meet the needs of a variety of applications in the field of electronics. It provides a reliable and secure environment for the insertion of ICs, featuring a unique socket-pin contact technology and a special low-resistance design. It also utilizes advanced thermal dissipation technology, ensuring that the contact points remain cooler and that the ICs remain safe and secure during assembly. The 08-7360-10 Socket from JST is thus a great choice for all types of IC-related applications.
The specific data is subject to PDF, and the above content is for reference
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