09-0518-11 Allicdata Electronics
Allicdata Part #:

09-0518-11-ND

Manufacturer Part#:

09-0518-11

Price: $ 0.94
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN SOCKET SIP 9POS GOLD
More Detail: N/A
DataSheet: 09-0518-11 datasheet09-0518-11 Datasheet/PDF
Quantity: 1000
84 +: $ 0.85050
Stock 1000Can Ship Immediately
$ 0.94
Specifications
Series: 518
Packaging: Bulk 
Part Status: Active
Type: SIP
Number of Positions or Pins (Grid): 9 (1 x 9)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Open Frame
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: --
Termination Post Length: 0.125" (3.18mm)
Material Flammability Rating: UL94 V-0
Current Rating: 3A
Contact Resistance: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

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Sockets for Integrated Circuit (ICs), transistors and other electronic components have become increasingly popular in applications because they offer many advantages over traditional hardwired circuits. Socketed components are faster, consume less power, and are easier to install and maintain.

In the broadest sense, a socket consists of two connected conductive elements, such as a wire or a trace on a printed circuit board (PCB). The two connecting elements establish an electrical connection by forming a contact point. The contact point is typically established when the two elements are pressed together, causing a conductive path to be formed between them.

Sockets can be used for both surface-mount components and for through-hole components. With surface-mount devices, the contact points can be established using a variety of techniques, such as soldering or bonding. Through-hole components, on the other hand, require the socket to effectively “bridge” the two insulated layers of the PCB.

The most basic type of socket for ICs, transistors and other components is the dual in-line package (DIP). DIP sockets consist of two parallel rows of pins, which contact the terminals of the component. The pins may be soldered onto the PCB or connected to other electrical connections. DIP sockets are commonly used in both industrial and consumer electronics applications.

Surface mount technology (SMT) sockets are commonly used for ICs and other components with small packages, such as quad flat package (QFP) and thin small outline package (TSOP). These sockets are designed to contact the component’s terminals at a single point. This type of socket is usually designed with a detachable plastic frame that can be inserted into a PCB’s surface mount pads. The pins are then inserted into the frame to contact the component’s terminals.

Another type of socket is the zero insertion force (ZIF) socket, which is commonly used for devices with larger packages, such as plastic leaded chip carriers (PLCCs). ZIF sockets are designed with two parallel rows of contacts, which are arranged in a curved array. The curvature of the contacts allows the component to be easily inserted and then “locked” into place. This type of socket is generally used in applications where the ICs or other components will be frequently changed.

Sockets for ICs, transistors and other components have become an integral part of modern electronics, providing an easy means of connecting components to the circuit board. By using a socket, rather than soldering, components can be easily removed and replaced, and the contact points can be tested and re-soldered if necessary. The use of sockets also eliminates the need for frequent maintenance, saving both time and money in the long run.

The specific data is subject to PDF, and the above content is for reference

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