1-1814642-3 Allicdata Electronics
Allicdata Part #:

1-1814642-3-ND

Manufacturer Part#:

1-1814642-3

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: CONN IC DIP SOCKET 18POS GOLD
More Detail: N/A
DataSheet: 1-1814642-3 datasheet1-1814642-3 Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Termination: Solder
Contact Resistance: 10 mOhm
Current Rating: 1A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.112" (2.84mm)
Operating Temperature: -55°C ~ 125°C
Housing Material: Thermoplastic, Polyester
Contact Material - Post: Brass
Contact Finish Thickness - Post: 29.5µin (0.75µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Series: --
Features: Open Frame
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 18 (2 x 9)
Type: DIP, 0.3" (7.62mm) Row Spacing
Part Status: Obsolete
Packaging: Tube 
Description

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1-1814642-3 Applications and Working Principle of Sockets for ICs, Transistors

A socket for integrated circuits (ICs) and transistors comes in the form of a printed circuit board or IC socket. Either way, the adapter is designed to provide an electrical connection between a microcontroller or other high-speed circuit and its associated ICs.

Sockets are an effective way of expanding or modifying a system and simplifying the debugging process. They can also be used in prototyping and extensive testing. A socket should be designed for the specific application and should fit the requirements for rigidity and cost.

1-1814642-3 is an IC and transistor socket from Harwin. It offers superior performance and reliability through its advanced pin connections and tension plates. This socket is designed for robust and precise connections for ICs, transistors, and integrated circuits.

Applications of 1-1814642-3

1-1814642-3 is used to connect ICs, transistors, and integrated circuits to printed circuit boards. This socket has a pitch of 0.5 mm and is designed for applications where low impedance and superior conductivity are desired. It is ideal for use with built-in chips in smart phones, tablets, and other digital equipment.

This type of socket can also be used as an interface between a microcontroller or other digital circuitry and its associated components. Additionally, 1-1814642-3 can be used to rapidly connect/disconnect wires for control signals, power, or ground. The socket is also suitable for prototyping, debugging, and testing.

Working Principle of 1-1814642-3

1-1814642-3 comprises two individual parts. The first part is the socket itself which consists of gold-plated spring-loaded pins interspaced between two non-moving plates of either plastic or copper. This part is then mounted on a printed circuit board and made part of the circuit.

The other part is the IC or transistor which has its own gold-plated spring-loaded pins, each of which is soldered onto the printed circuit board. When the two parts, the socket and the IC/transistor, are connected together the pins on the two parts interlock and form an electrical connection.

The pin connections are held tight by tension plates which connect the two parts together, due to a slight buckling of the pins which then slide ever so slightly within the slot on the tension plate. This creates a force in both directions that keeps the pins in close contact to ensure a secure connection.

Conclusion

The use of sockets for ICs and transistors is an efficient method of electronic connecting components to a printed circuit board. The 1-1814642-3 socket system from Harwin provides superior performance and reliability while maintaining efficiency and cost. The spring loaded pins and tension plates create a secure connection between the IC/transistors and the socket. This socket is a popular choice for use in smart phones, tablets, and other digital equipment.

The specific data is subject to PDF, and the above content is for reference

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