1-1825108-3

Sockets for ICs, Transistors provide an interface between an integrated circuit (IC) and its associated circuit board. They facilitate the interconnection of the components on the board. Socket design and construction has to take into consideration the static and dynamic characteristics of the IC being used, the board layout, power requirements, and other circuitry on the board. This article will discuss the application fields and the working principles of socket 1-1825108-3.

Application Fields of Socket 1-1825108-3

Socket 1-1825108-3 is generally used for double-sided or double-layer microcircuits. It can be used for reliable mounting and electrical connections of various integrated circuit packages. Typical application fields of Socket 1-1825108-3 include but are not limited to consumer electronics, automotive electronics, medical electronics, communications, and computers.

Working Principles of Socket 1-1825108-3

Socket 1-1825108-3 is a surface-mount device that provides a reliable electrical interface between the board and the integrated circuit package. It is designed to accommodate surface-mount packages with pins ranging from 0.8 mm to 1.2 mm. It uses a metal contact spring that enables electrical contact with the integrated circuit package pins.

Socket 1-1825108-3 uses a simple, low-cost design. Its internal metal contact springs have low-resistance contacts and are designed to flex and move when the package is inserted. They compress against the integrated circuit pins to ensure a reliable connection during operation. The socket also has an open frame design which allows for a smaller overall size. This makes it ideal for use in applications such as handheld and other portable electronic devices.

Advantages of Using Socket 1-1825108-3

One of the main advantages of Socket 1-1825108-3 is its low-cost design. The socket is easy to install and its open frame design helps to reduce space requirements. Its metal contact springs ensure reliable electrical contact and allows for higher data rates compared to other socket designs. Additionally, its thermal properties make it suitable for applications in which the device is subject to high temperatures. This makes it more suitable for use in demanding environments than other socket designs.

Conclusion

Socket 1-1825108-3 provides an interface between the board and the integrated circuit package. It is designed to accommodate surface mounted components with pins ranging from 0.8 mm to 1.2 mm. Its advantages include its low-cost, space saving design, and its high speed capability. Its thermal properties make it suitable for use in demanding environments such as medical and industrial applications. Socket 1-1825108-3 is a reliable solution for double-sided or double-layer microcircuits.