1-1825376-2 Allicdata Electronics
Allicdata Part #:

A35059-ND

Manufacturer Part#:

1-1825376-2

Price: $ 1.52
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: CONN IC DIP SOCKET 28POS GOLD
More Detail: N/A
DataSheet: 1-1825376-2 datasheet1-1825376-2 Datasheet/PDF
Quantity: 1000
1500 +: $ 1.38103
Stock 1000Can Ship Immediately
$ 1.52
Specifications
Features: Closed Frame
Contact Resistance: 30 mOhm
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.120" (3.05mm)
Operating Temperature: -55°C ~ 125°C
Housing Material: Thermoplastic, Glass Filled
Contact Material - Post: Beryllium Copper
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Termination: Solder
Series: Diplomate DL
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 28 (2 x 14)
Type: DIP, 0.6" (15.24mm) Row Spacing
Part Status: Active
Packaging: Tube 
Description

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Sockets for ICs, transistors, and other components are important to the functionality of any electronic device. They allow for components to be inter-connected easily, reliably, and with minimal disruption. A properly engineered socket for ICs, transistors, and other components will help to ensure that everything works correctly and will last for a long time. This article will discuss the application field and working principle of 1-1825376-2.

1-1825376-2 Application Field

1-1825376-2 is a two-position dual in-line socket designed for the conduction of power. This socket is best suited for applications that require a high-performance power connection. The socket features a gold plated contacts and solderable terminals. The contact area is also rugged, mold-injected plastic with two outer housings that are also plastic. This socket has a maximum current of 5 Amps at 90 °C and a contact resistance of less than 20 mΩ at 1.5A and 10V.

1-1825376-2 is especially useful in power connection applications related to portable devices such as laptop computers, mobile phones, and tablets. The socket is also compatible with logic devices including digital signal processors, microprocessors, microcontrollers, and peripherals. Additionally, 1-1825376-2 is suitable for use in circuit boards, communication systems, and consumer electronics products.

1-1825376-2 Working Principle

The principle of any socket for ICs, transistors, and other electrical components involves creating points of contact between the components and providing electrical pathways for the introduction and dispersal of electricity. 1-1825376-2 works in much the same way. This socket features two gold plated contacts that are connected to two robust plastic housings. These contacts are designed to make contact with two electrodes, while the plastic housings provide support and protection.

When power is introduced via a current source, the two contacts of the 1-1825376-2 socket bridge the gap between the two electrodes and create a physical and electrical connection. This connection allows electric current the flow from the first electrode, through the socket, and out to the second electrode. Once all the unwanted electric current is dispersed, the flow of electricity is completed and a stable connection is maintained.

Conclusion

In summary, the 1-1825376-2 socket is a two-position dual in-line socket designed for the conduction of power. It features a gold plated contacts and solderable terminals, as well as a rugged, mold-injected plastic with two outer housings that are also plastic. This socket has a maximum current of 5 Amps at 90 °C and a contact resistance of less than 20 mΩ at 1.5A and 10V. It is best suited for applications that require a high-performance power connection such as laptop computers, mobile phones, tablets, logic devices, circuit boards, communication systems, and consumer electronics products. The principle behind the socket for ICs, transistors, and other electrical components involves creating points of contact between the components and providing electrical pathways for the introduction and dispersal of electricity.

The specific data is subject to PDF, and the above content is for reference

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