1-1932680-2 Allicdata Electronics
Allicdata Part #:

1-1932680-2-ND

Manufacturer Part#:

1-1932680-2

Price: $ 1.39
Product Category:

Connectors, Interconnects

Manufacturer: TE Connectivity AMP Connectors
Short Description: CONN SKT DIMM 240POS PCB
More Detail: 240 Position DIMM DDR3 SDRAM Socket Through Hole
DataSheet: 1-1932680-2 datasheet1-1932680-2 Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
5400 +: $ 1.25798
Stock 1000Can Ship Immediately
$ 1.39
Specifications
Series: --
Packaging: --
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Style: DIMM
Number of Positions: 240
Memory Type: DDR3 SDRAM
Standards: --
Mounting Type: Through Hole
Features: Board Lock, Latches
Mounting Feature: Normal, Standard - Top
Contact Finish: Gold
Contact Finish Thickness: 20.0µin (0.51µm)
Description

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Memory Connectors - Inline Module Sockets

Inline Module Sockets are an advanced category of connectors that can be used to connect a memory device such as a processor, memory chip, or even a memory storage device to an external circuit. These connectors are usually part of an interconnected system, where each component of the system has its own unique characteristics. An example of such an interconnected system is the 1-1932680-2 socket, which is designed to be compatible with the European Standard for Electrical Contacts in Electronic Components and Equipments, EN 50022. The EN 50022 standard requires that all connectors be able to withstand temperatures between -40°C and +120°C and must meet the minimum requirements of an insulation and contact resistance, which should be 10kΩ and 200MΩ respectively.

The 1-1932680-2 socket is a type of receptacle connector which is designed to be easily inserted into prongs and is commonly used to connect components of a memory device or a computer system. The most common types of connectors are three-prong, four-prong, and six-prong connectors, although some other variations exist. These connectors come with an integral latch and spring which make them easy to insert and remove from the prongs, allowing for much easier installation of memory devices.

The working principle of an inline module socket is based on the principle of interconnection between different components or devices. The connectors within the inline module socket are arranged in such a manner that when a device is inserted into the pronged slot, its electrical connections will become attached to the respective pins and contacts of the socket. This connection is then used to establish an electrical current between the device and the external circuit. The various pins and contacts of the inline module socket are connected to the external circuit by two or more conductors depending on the number of pins and contacts.

As the inline module socket is often used to connect memory devices, they are usually designed to be as reliable and efficient as possible. To ensure their effectiveness, these connectors usually come equipped with a number of features such as a black oxide coating for improved contact resistance and insulation, solderless connections which reduce the level of solder leakage, and a copper-nickel connection which prevents oxidation and resulting corrosion.

Inline Module Sockets are necessary for proper interconnection between different memory devices due to their easy-to-insert design, reliable interference protection, and high resistance to heat and interference. These connectors are a perfect example of innovation and effectiveness in the field of electronic components, with their ability to make connections between different devices much safer and more efficient. With their easy-to-insert design and reliable interference protection, these connectors can help to ensure that memory devices remain securely connected even in tough environmental conditions. These connectors are sure to be of great use for any memory device application, and they are sure to remain an important part of the memory device market for years to come.

The specific data is subject to PDF, and the above content is for reference

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