1-2013620-1

Features:	Open Frame
Contact Resistance:	--
Material Flammability Rating:	UL94 V-0
Termination Post Length:	--
Operating Temperature:	--
Housing Material:	Thermoplastic
Contact Material - Post:	Copper Alloy
Contact Finish Thickness - Post:	15.0µin (0.38µm)
Contact Finish - Post:	Tin-Lead
Pitch - Post:	0.039" (1.00mm)
Termination:	Solder
Series:	--
Mounting Type:	Surface Mount
Contact Material - Mating:	Copper Alloy
Contact Finish Thickness - Mating:	15.0µin (0.38µm)
Contact Finish - Mating:	Gold
Pitch - Mating:	0.039" (1.00mm)
Number of Positions or Pins (Grid):	989 (35 x 36)
Type:	PGA, ZIF (ZIP)
Part Status:	Active
Packaging:	Tape & Reel (TR)

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Introduction to Sockets for ICs, Transistors

The world of computing has changed rapidly over the last several decades, and with it, the devices that perform computing functions have evolved to become smaller in size and more powerful. Integrated circuits (ICs) and transistors are just two of the components that have been instrumental in this evolution. With advancements in semiconductor technology, sockets for ICs and transistors have become increasingly popular choices when it comes to connecting and transferring data to and from these devices. In this article, we will explore the application field and working principle of 1-2013620-1 sockets for ICs and transistors.

What are Sockets for ICs and Transistors?

A socket for ICs and transistors is a device that is designed to house and effectively connect integrated circuits and transistors. These devices are available in a variety of shapes and sizes, and depending on their design, may specialize in either ICs or transistors, though they can also be designed to work with both. The most common types of socket for ICs and transistors are the dual in-line package (DIP) socket, flat package (FPP) socket, and the surface mount package (SMP) socket. The DIP socket is designed to house devices with rectangular-shaped pins, and is usually found in 8, 14, 16, 18, 20, 24, 28, and 40 pin models. The FPP socket is designed to house devices with flat-shaped pins, and is usually found in 6, 8, 16, and 20 pin models. Finally, the SMP socket is designed to house devices with surface mount pins, and is available in a variety of different pin designs and models.

Application Field & Working Principle of 1-2013620-1 Socket

The 1-2013620-1 socket is a type of dual in-line package socket which is designed for use with integrated circuits and transistors. It is most commonly used on PCBs (Printed Circuit Boards) and in machines, primarily in consumer electronics and automation applications. The 1-2013620-1 socket is made up of two main components: a metal chassis and a plastic housing.The frame of the 1-2013620-1 socket consists of a metal chassis which is composed of two basic parts: the top and bottom flanges. The top flange is designed to serve as a mounting point for the PCB, while the bottom flange has various slots which are used to insert and secure the plastic housing. The plastic housing itself is composed of a lower and upper section, each of which contains a variety of metal contacts for the purpose of providing electrical connections. Once the plastic housing is positioned over the slots in the bottom flange, the housing is secured to the chassis using pins which run through the top flange. The pins ensure that the housing remains in place even when the board is subjected to vibration. The metal contacts in the plastic housing are then used to establish electrical connections with the IC or transistor pins.When the IC or transistor is inserted into the 1-2013620-1 socket, the pins connector into the metal contacts in the plastic housing. The metal contacts, in turn, make contact with the PCB board, thus completing the electrical circuit. This ensures that the integrated circuit or transistor is correctly wired, and the appropriate signals can be sent and received.

Conclusion

Sockets for ICs and transistors are an important component in modern computing, providing a reliable and secure method of connecting integrated circuits and transistors to PCBs. The 1-2013620-1 socket is a type of dual in-line package (DIP) socket which is designed for use with integrated circuits and transistors. This socket consists of a metal chassis and a plastic housing which contains metal contacts which are used to establish electrical connections with the IC or transistor pins. The 1-2013620-1 socket is most commonly found in PCBs and machines, primarily in consumer electronics and automation applications.

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