1-2013620-3

Features:	Open Frame
Contact Resistance:	--
Material Flammability Rating:	UL94 V-0
Termination Post Length:	--
Operating Temperature:	--
Housing Material:	Thermoplastic
Contact Material - Post:	Copper Alloy
Contact Finish Thickness - Post:	--
Contact Finish - Post:	--
Pitch - Post:	0.039" (1.00mm)
Termination:	Solder
Series:	--
Mounting Type:	Surface Mount
Contact Material - Mating:	Copper Alloy
Contact Finish Thickness - Mating:	15.0µin (0.38µm)
Contact Finish - Mating:	Gold
Pitch - Mating:	0.039" (1.00mm)
Number of Positions or Pins (Grid):	988 (35 x 36)
Type:	PGA, ZIF (ZIP)
Part Status:	Obsolete
Packaging:	Tape & Reel (TR)

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Sockets for ICs, Transistors

Integrated circuits and transistors are two of the most common components of electronic devices in the modern world. But, they require special sockets for connection and use. These socket types range from board-level mounting to those designed for Chip-On-Board applications. Sockets for ICs and transistors provide reliable connections for the components so they can properly function in whatever application they are used in.

1-2013620-3 Application Field and Working Principle

The 1-2013620-3 socket is a vertical, 16-lead socket designed for use with ICs and transistors. It features an integrated retention bracket, ensuring a secure connection of the component within the socket. It is a widely used model and is used in a variety of applications, from automotive and telecom to consumer electronics and medical. This socket type also has the capability of being both mechanically and electrically robust, which allows for reliable connections. It also has screened terminals, which helps provide an even higher level of signal integrity. Moving onto the working principle side of the application field, this socket works by allowing an IC or transistor to be physically and electronically connected to a circuit board.The electrical connection is twofold, with pins on both the socket and the IC or transistor soldered to the circuit board thus providing a physical and electrical bond between the two components. The pins ensure that the contact between the IC and the socket is conductive, and prevents any abrasion or moisture ingress. Through this electrical connection, power can be supplied to the IC or transistor enabling its functions. Once the IC or transistor is connected to the board and the socket, many options for the socket design become available to better accommodate the particular application. These components and their sockets are also designed in such a way to dissipate any static electricity, which in turn prevents the buildup of destructive electrostatic discharge (ESD).

Summary

Sockets for ICs and transistors provide reliable connections for a wide variety of electronic applications, from automotive and telecom to consumer electronics and medical. The 1-2013620-3 socket is vertically oriented, 16-lead socket designed for use with ICs and transistors. It features an integrated retention bracket, screened terminals for improved signal integrity, and dissipates static electricity to prevent electrostatic discharge. The socket works by providing an electrical connection between the IC/transistor and the circuit board, ensuring power is supplied correctly and providing a physical bond between the two components.

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