10-0501-21

Termination:	Wire Wrap
Contact Resistance:	--
Current Rating:	1A
Material Flammability Rating:	UL94 V-0
Termination Post Length:	0.420" (10.67mm)
Operating Temperature:	-55°C ~ 125°C
Housing Material:	Polyamide (PA46), Nylon 4/6, Glass Filled
Contact Material - Post:	Phosphor Bronze
Contact Finish Thickness - Post:	10.0µin (0.25µm)
Contact Finish - Post:	Gold
Pitch - Post:	0.100" (2.54mm)
Series:	501
Features:	--
Mounting Type:	Through Hole
Contact Material - Mating:	Phosphor Bronze
Contact Finish Thickness - Mating:	10.0µin (0.25µm)
Contact Finish - Mating:	Gold
Pitch - Mating:	0.100" (2.54mm)
Number of Positions or Pins (Grid):	10 (1 x 10)
Type:	SIP
Part Status:	Active
Packaging:	Bulk

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Sockets for ICs, TransistorsSockets for ICs (Integrated Circuits) and transistors are used to interface between a circuit or system and the physical chip. The physical chip consists of a semiconductor substrate which is patted with many metal micro components and is typically of a small size.One of the most important things to consider when selecting a socket for an IC or transistor is pin compatibility. This is because the pin layout on the socket must match the layout on the device in order for it to fit and to properly function. Commonly, there are two types of sockets: those that use the same pin size and those that use a different pin size as the device. If the pin size is not compatible, then an adapter must be used to properly fit the device into the socket.The next step in selecting a socket is to choose the appropriate material. This is typically determined by the requirements of the application. Commonly used materials include ceramics, plastics and metals. The materials also determine the weight and form of the socket.The final step is to select the socket’s form factor. This includes the number of pins, pin orientation, the distance between the pins and other variables that are used to determine the size of the socket. These factors are important for ensuring proper contact with the device as well as proper heat dissipation.Once the appropriate socket has been chosen, it is ready to be connected to the circuit. One way to do this is with through-hole mounting, where the socket is attached to a PCB (Printed Circuit Board). This is typically done by soldering the socket’s mounting tabs to the PCB’s traces. Another method is surface mount, this is where the components are soldered onto the top of the PCB directly. This type of mounting is advantageous because it allows for a much closer pitch between components and can create a smaller overall design footprint.In order to provide additional protection from EMI (electromagnetic interference), sockets are commonly manufactured with built-in shielding. This shielding typically surrounds the socket and can be made from metals, such as aluminum or steel. Additionally, the socket may be plated with additional materials to provide further protection from EMI.For power applications, specialty sockets may be utilized. These sockets feature higher current ratings than regular IC sockets, and are also designed for higher voltage ratings. When using these sockets, good insulation materials should always be present in order to prevent short circuits or arcs.Overall, sockets for ICs and transistors are used to interface between an electrical circuit or system and the physical chip. They can be made from numerous materials, and a wide variety of form factors are available. In addition to this, sockets may also be designed with built-in shielding , which can protect against environmental EMI. Furthermore, specialty sockets are available to handle power applications such as higher current and voltage ratings.

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