10-2823-90 Allicdata Electronics
Allicdata Part #:

10-2823-90-ND

Manufacturer Part#:

10-2823-90

Price: $ 4.63
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN IC DIP SOCKET 10POS GOLD
More Detail: N/A
DataSheet: 10-2823-90 datasheet10-2823-90 Datasheet/PDF
Quantity: 1000
17 +: $ 4.21359
Stock 1000Can Ship Immediately
$ 4.63
Specifications
Termination: Solder
Contact Resistance: --
Current Rating: 1.5A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.145" (3.68mm)
Operating Temperature: --
Housing Material: Polyamide (PA46), Nylon 4/6
Contact Material - Post: Phosphor Bronze
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Series: Vertisockets™ 800
Features: Closed Frame
Mounting Type: Through Hole, Right Angle, Horizontal
Contact Material - Mating: Phosphor Bronze
Contact Finish Thickness - Mating: 10.0µin (0.25µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 10 (2 x 5)
Type: DIP, 0.2" (5.08mm) Row Spacing
Part Status: Active
Packaging: Bulk 
Description

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Sockets for ICs, Transistors

10-2823-90 sockets are a type of electronic component used for connecting Integrated Circuits (ICs), transistors, and other devices on a printed circuit board (PCB). It allows for a more rapid and reliable connection than soldering and offers improved voltage handling capabilities. The 10-2823-90 sockets offer excellent insulation, which helps to reduce the amount of stray electrical current and protect against short circuits. Additionally, the greater physical stability offered by these sockets reduces the risk of short circuits caused by accidental contact or mechanical stress.

Application Field

10-2823-90 sockets are most commonly used in signal processing applications, such as telecommunications, gaming, automotive, and industrial applications. As such, they are often used to connect resistors, capacitors, and transistors to printed circuit boards. Additionally, these sockets can be used to create an efficient design with higher bandwidth and/or low signal loss. For example, 10-2823-90 sockets can be used in networking applications to reduce crosstalk and maintain signal integrity.

Working Principle

The 10-2823-90 sockets provide mechanical and electrical connection between the integrated circuit and the printed circuit board. These sockets contain contact elements which are connected to the pins of the component (maximum of 28 pins per socket). These contact elements then connect to the printed circuit board via plated through-holes. Depending on the application, the contact elements can be arranged in either a vertical or horizontal position.

These contact elements provide electrical connections between the integrated circuit and the printed circuit board by way of signal traces. Additionally, the contact elements are designed to act as mechanical springs which exert pressure against the legs of the component, providing a secure connection between the two pieces. This design also helps to ensure that the contact elements make good electrical connections when the component is inserted into the socket.

The 10-2823-90 sockets are designed for single use and are compatible with ICs, transistors, and other parts which can be attached using a DIP package. The wide range of available subminiature components these sockets can connect will enable a variety of solutions for both development and production requirements.

Conclusion

The 10-2823-90 sockets are an excellent choice for applications requiring signal processing. These sockets provide a reliable and robust connection between integrated circuits, transistors, and other devices. Furthermore, the mechanical spring contact design ensures that a secure connection is provided with a high level of electrical integrity. With their wide range of compatibility and improved voltage handling capabilities, these sockets offer an efficient design solution for a variety of applications.

The specific data is subject to PDF, and the above content is for reference

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