10-8470-610C Allicdata Electronics
Allicdata Part #:

10-8470-610C-ND

Manufacturer Part#:

10-8470-610C

Price: $ 4.77
Product Category:

Connectors, Interconnects

Manufacturer: Aries Electronics
Short Description: CONN IC DIP SOCKET 10POS GOLD
More Detail: N/A
DataSheet: 10-8470-610C datasheet10-8470-610C Datasheet/PDF
Quantity: 1000
16 +: $ 4.33834
Stock 1000Can Ship Immediately
$ 4.77
Specifications
Series: 8
Packaging: Bulk 
Part Status: Active
Type: DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid): 10 (2 x 5)
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Mounting Type: Through Hole
Features: Closed Frame, Elevated
Termination: Solder
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 10.0µin (0.25µm)
Contact Material - Post: Brass
Housing Material: Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature: -55°C ~ 105°C
Termination Post Length: 0.140" (3.56mm)
Material Flammability Rating: UL94 V-0
Current Rating: 3A
Contact Resistance: --
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The 10-8470-610C is a socket for ICs, transistors, and other semiconductor components. Its application field is wide, and it is widely used in the fields of consumer, automotive, industrial, medical, aerospace and communication products.

The socket is designed with a high-density, double-row pin-in-socket architecture, making it the ideal choice for very high pin count devices. The pins are made of corrosion-resistant gold for superior electrical and thermal contact. The different pinouts and mix-and-match configurations of the socket allow for more flexibility in the design process. With the 10-8470-610C, designers can create custom boards with multiple signals in a small footprint.

The 10-8470-610C socket also offers advantages when it comes to cost and assembly. By eliminating the risk of handling large boards and reducing the number of parts needed, the socket can help in reducing assembly costs. The socket’s ultra-low profile design helps reduce board space, further reducing costs. The solderless assembly method makes the socket quick and easy to install.

The 10-8470-610C socket also has a built-in latching mechanism to securely hold the device in place and protect it from shock and vibration. The socket is made of a durable molded plastic material, which is resistant to high temperatures. The socket also features a unique grounding solution to ensure that the device remains grounded and electrostatically safe at all times. This helps to ensure the quality of the installation and its performance over time.

The 10-8470-610C socket also has a built-in self-aligning feature that makes installation easier. It also comes with a cable clamp to secure the cables and reduce the need for additional tools or laborers. Its mechanical design features also reduce the likelihood of device damage due to shock or vibration.

The 10-8470-610C socket also has a working principle based on a pin-in-socket design. The pins of the socket are made of corrosion-resistant gold and have a high level of thermal and electrical contact. The socket also has a special ceramic compound to enhance its working performance. This compound ensures that the socket is reliable and has a consistent temperature range, offering better performance and longer life.

The 10-8470-610C socket also features ESD protection, which prevents the device from damage due to electrostatic discharge. The socket is designed to dissipate electrostatic charges quickly to avoid damage to the device. This helps to ensure the safety of the device and the surrounding environment.

The 10-8470-610C socket is an ideal solution for applications that require low profile, high-density, durable IC and transistor sockets. Its application field is wide, which means it can be used in many commercial, automotive, industrial, medical, aerospace and communication products. In addition, its cost-effectiveness and high performance make it an ideal solution for these applications.

The specific data is subject to PDF, and the above content is for reference

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