100-008-001 Allicdata Electronics
Allicdata Part #:

100-008-001-ND

Manufacturer Part#:

100-008-001

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: 3M
Short Description: CONN IC DIP SOCKET 8POS GOLD
More Detail: N/A
DataSheet: 100-008-001 datasheet100-008-001 Datasheet/PDF
Quantity: 1000
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Termination: Solder
Contact Resistance: --
Current Rating: 1A
Material Flammability Rating: UL94 V-0
Termination Post Length: 0.126" (3.20mm)
Operating Temperature: -65°C ~ 125°C
Housing Material: Polyphenylene Sulfide (PPS), Glass Filled
Contact Material - Post: Brass
Contact Finish Thickness - Post: Flash
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Series: 100
Features: Closed Frame, Seal Tape
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 8.00µin (0.203µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.3" (7.62mm) Row Spacing
Part Status: Obsolete
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Sockets for ICs, Transistors are used to connect integrated circuits and transistors to a variety of other components. These sockets come in various shapes, sizes, and types and are designed to accommodate various types of ICs and transistors. The design and construction of these sockets have evolved over the years to provide a reliable connection for the ICs and transistors while allowing easy access.

The 100-008-001 application field and working principle is quite simple: the socket consists of a metal or plastic body, a contact assembly, and a mechanical retention system. It is designed to provide the correct amount of electrical contact between a integrated circuit on one side and a transistor or other electrical components on the other side. The contact assembly, typically made of conductive material, is placed into the body and secured, while the retention system holds the contacts in place. The contact assembly must provide a reliable, continuous and reliable electrical connection between the two components.

The contact assembly is typically constructed from material such as nickel, gold, silver or copper to ensure electrical conductivity. Depending on the size and type of components, the contact assembly may need to be tailored or customized to meet specific requirements. For instance, some socket systems require larger contact areas to ensure better electrical contact with larger components, such as transistors. The contact assembly may also need to be customized depending on the operating environment. Depending on the type of application, the contact assembly may need to be tailored to withstand different levels of heat, pressure, or chemical exposure.

The contact assembly is usually held in place by the mechanical retention system which includes a locking device and a spring. The locking device, typically a screw, locks the contact assembly into the body while the spring applies pressure to ensure the contacts remain firmly in place. The contact pressure is usually adjusted by turning the locking device or adjusting the spring to ensure a reliable connection. The mechanical retention system also helps to protect the contacts from damage due to vibration or shock, while allowing for easy access and connection when needed.

The 100-008-001 application field and working principle provide an efficient and reliable way to connect ICs and transistors. The design allows for easy insertion and removal of components, while providing a reliable connection that holds up against the elements. With the various types, shapes, and sizes available, ICs and transistors can be connected quickly and securely. This is a great way to make sure electronic components remain functioning properly and for a longer amount of time.

The specific data is subject to PDF, and the above content is for reference

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