10005639-22308LF Allicdata Electronics
Allicdata Part #:

10005639-22308LF-ND

Manufacturer Part#:

10005639-22308LF

Price: $ 0.98
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: CONN SKT DIMM 240POS PCB
More Detail: 240 Position DIMM DDR2 SDRAM Socket Through Hole
DataSheet: 10005639-22308LF datasheet10005639-22308LF Datasheet/PDF
Quantity: 1000
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL): 1 (Unlimited)
1680 +: $ 0.89338
Stock 1000Can Ship Immediately
$ 0.98
Specifications
Series: 10005639
Packaging: Tray 
Lead Free Status / RoHS Status: --
Part Status: Active
Moisture Sensitivity Level (MSL): --
Connector Style: DIMM
Number of Positions: 240
Memory Type: DDR2 SDRAM
Standards: MO-237
Mounting Type: Through Hole
Features: Board Lock, Latches
Mounting Feature: Normal, Standard - Top
Contact Finish: Gold
Contact Finish Thickness: 30.0µin (0.76µm)
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Memory connectors, such as 10005639-22308LF, are devices that, as the name suggests, are used to connect memory components together. Such devices can include CPUs, motherboards, memory slots, and PC cards. The devices themselves are available in various types and sizes, with some being better suited for specific types of applications then others. For example, inline module sockets provide a reliable mechanical solution for connecting memory components in memory systems. The socket itself consists of several components, including pins, a busline, as well as mechanical and electrical connections.

The 10005639-22308LF is an example of an inline module socket. It works by providing the connection between the memory components via its pins, busline, and electrical and mechanical connections. Additionally, the module has a series of integrated resistors that enable the memory module to interface safely with the memory system. This ensures that a proper connection and power is maintained between the two components. The module also features heat-resistance and superior signal integrity, ensuring that it can withstand harsh environmental conditions, and that it can maintain the highest level of signal integrity.

The main application of the 10005639-22308LF is in memory systems. It is particularly useful when connecting multiple memory components together, such as CPUs, motherboards, memory slots, and PC cards. In such applications, the memory system can be accessed much faster and more accurately, as the module ensures a reliable connection between the components. Additionally, the module can also be used in applications involving high-speed data transfer, as its components are designed for maximum speed, reliability, and signal integrity.

In terms of its working principle, the 10005639-22308LF uses the resistance of its pins, busline, and mechanical and electrical connections to achieve a reliable connection between the memory components. The pins provide the physical connection between the components, while the busline allows for quicker data transfer. Additionally, the electrical and mechanical connections ensure that a safe and consistent connection is maintained. This setup allows for the reliable transfer of data, as well as a safe and secure connection between the two components.

In conclusion, the 10005639-22308LF is a inline module socket that is designed for use in memory systems. It works by providing a reliable mechanical connection between the memory components via its pins, busline, and electrical and mechanical connections. Additionally, the module features integrated resistors, heat-resistance, and superior signal integrity. These features ensure that the module is reliable for use in memory systems, as well as applications involving high-speed data transfer. The workings of the module are based on its resistance, which is achieved through its pins, busline, and electrical and mechanical connections.

The specific data is subject to PDF, and the above content is for reference

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