Allicdata Part #: | 10033854-252TSLF-ND |
Manufacturer Part#: |
10033854-252TSLF |
Price: | $ 7.14 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Amphenol FCI |
Short Description: | CONN SKT SODIMM 200POS SMD REV |
More Detail: | 200 Position SODIMM DDR2 SDRAM Socket Surface Moun... |
DataSheet: | 10033854-252TSLF Datasheet/PDF |
Quantity: | 1000 |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
700 +: | $ 6.48610 |
Series: | 10033854 |
Packaging: | Tray |
Lead Free Status / RoHS Status: | -- |
Part Status: | Active |
Moisture Sensitivity Level (MSL): | -- |
Connector Style: | SODIMM |
Number of Positions: | 200 |
Memory Type: | DDR2 SDRAM |
Standards: | MO-274 |
Mounting Type: | Surface Mount, 30° Angle |
Features: | Board Guide, Latches |
Mounting Feature: | Reverse |
Contact Finish: | Gold |
Contact Finish Thickness: | 11.8µin (0.30µm) |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Memory connectors are a type of hardware used to connect memory devices like flash and DRAM to microprocessors or other memory storage devices. They are usually designed to be able to carry large amounts of data at high speed and to support the latest technology in memory architecture. Inline Module Sockets are also referred to as memory connectors, and they come in a wide range of sizes and shapes to fit a variety of memory specifications. The 10033854-252TSLF is a specific type of inline module socket that is designed for use with DDR3 and DDR4 memory modules.
The 10033854-252TSLF inline module socket is designed for memory modules that have a maximum component height of 0.20 inches. It is made of a high-temperature plastic and has a gold-plated metal contact that provides excellent electrical connection between the memory module and the processor. The socket is designed to be used in parallel connections and also comes with locking clips that will secure the module in place. It is designed for standard 1.20-inch row spacing and is compliant with the RoHS regulations.
The 10033854-252TSLF has numerous applications, and it is also suitable for use in high-speed applications. It is designed to be used with DDR3 and DDR4 memory modules and therefore can be used for a wide range of memory requirements. It is suitable for use in tablets, smartphones, and other embedded systems. It is also a suitable alternative to more expensive memory connectors such as Ball Grid Arrays (BGA).
The 10033854-252TSLF inline module socket is designed to enable quick connection and disconnection of memory modules. It is designed with two hundred fifty-two pins that are spaced out according to a standard pattern, which helps to provide quick and secure connections. The socket also comes with a latching mechanism that securely holds the memory module in place while in use. This ensures that the memory module is not accidentally disconnected during use.
The working principle of the 10033854-252TSLF inline module socket is very simple. It is designed to act as a bridge between the memory module and the processor, transmitting data between them at high speeds. It uses electrical connections that provide excellent electrical communication between the two components. It also comes with a latching mechanism that holds the memory module securely in place during use.
The 10033854-252TSLF inline module socket is an important piece of hardware for many system designs. It is designed to enable quick and secure connections between memory modules and processors. It has numerous applications in tablets, smartphones, and other embedded systems. It is also a suitable alternative to more expensive memory connectors such as Ball Grid Arrays (BGA). It is designed to be used with DDR3 and DDR4 memory modules and its simple design enables maximum speed and reliability.
The specific data is subject to PDF, and the above content is for reference
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