10079248-13117LF

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Inline Module Sockets provide the interface between an electronic device or chip and an incorporated peripheral or another electronic device. The 10079248-13117LF Inline Module Socket includes a solid, single piece, plastic housing, providing a working interface to existing components and electronics. This type of socket offers very low insertion force and is capable of minimal contact resistance.

The 10079248-13117LF Inline Module Socket is designed for a variety of applications. This versatile socket is a crucial component for applications including telecommunications, networking, consumer electronics, data processing, automotive, and medical equipment. The low profile design makes it suitable for applications where space is restricted and needs to accommodate high density components. The use of the socket is also beneficial in mobile device battery/memory connections and low voltage analog signals.

The 10079248-13117LF Inline Module Socket consists of a contoured lead frame and supporting boss for both snap-in and solder mounting. The housing is made out of a solid polyester or ABS material providing retention for the internal lead frame. The integrated contact system consists of precision-formed, stamped and plated components. The contact has a catch that prevents the contact from moving during times of thermal or mechanical shock.

The working principle of the 10079248-13117LF Inline Module Socket is based on its solid construction. The socket has a low profile design, featuring a snap fit and solder mount structure. Its contact system of precision-formed, stamped, and plated components ensure there is consistently low contact resistance and low insertion force. When connected, the contact system also enables for a security clamp to be applied, further securing the electrical connection between the socket and the module.

The 10079248-13117LF Inline Module Socket is advantageous when incorporated in electronics and electrical applications because of its low profile design, low insertion force, and low contact resistance. Its strong construction and contact system enable it to maintain reliable connections in applications where space is restricted and components are required to be high density.

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