10091777-F0E-80DLF

The 10091777-F0E-80DLF is a specialized backplane connector, which is designed to provide a reliable, high-density connection between two PCBs, used in a wide variety of systems. It has three primary characteristics which are its low profile, high quality and cost-effective nature, making it a desirable solution for connecting PCBs in any given application.

The 10091777-F0E-80DLF features an array of next-generation with a thin profile and contact pitch of 0.5mm, delivering up to 32 contact points arranged across two rows. This connector has the capability to interface with both 0.5mm pitch and dual row or single row connector configurations, ensuring a wide range of flexibility when connecting two boards. Furthermore, the 10091777-F0E-80DLF is designed with high quality materials such as Nylon 6-T to provide mechanical support and RF shielding, as well as low insertion forces.

In terms of working principle, the 10091777-F0E-80DLF is a solderless connection, in which the terminals of both connectors are connected together by heat-staking. This type of connection is especially useful for applications which require a high density and high frequency. Moreover, the heat-staking process ensures a reliable connection as it securely fastens the terminals without any gaps.

The 10091777-F0E-80DLF is a popular choice for integration within consumer electronics, telecommunications, aerospace and automotive applications due to its thin profile, reliable connection and wide range of configurations. This connector is also specifically designed to match specifications of high-performance applications, as it has been demonstrated to support data rates of 40 Gbps while maintaining signal integrity. With its wide range of benefits, the 10091777-F0E-80DLF is a reliable and cost-effective backplane connector for high speed and high density connection.