
Allicdata Part #: | 10113947-T0C-70B-ND |
Manufacturer Part#: |
10113947-T0C-70B |
Price: | $ 0.00 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Amphenol FCI |
Short Description: | XCEDE RGHT 2PVH 6COL WK |
More Detail: | N/A |
DataSheet: | ![]() |
Quantity: | 1000 |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Lead Free Status / RoHS Status: | Contains lead / RoHS non-compliant |
1 +: | 0.00000 |
Number of Columns: | 6 |
Voltage Rating: | -- |
Operating Temperature: | -55°C ~ 85°C |
Material Flammability Rating: | UL94 V-0 |
Current Rating: | -- |
Color: | Gray |
Contact Finish Thickness: | 30.0µin (0.76µm) |
Contact Finish: | Gold or Gold, GXT™ |
Features: | Key |
Contact Layout, Typical: | 18 Differential Pairs |
Termination: | Press-Fit |
Mounting Type: | Through Hole |
Series: | XCede® |
Number of Rows: | -- |
Pitch: | -- |
Number of Positions Loaded: | All |
Number of Positions: | -- |
Connector Style: | XCede®, Guide Right |
Connector Type: | Header, Male Pins and Blades |
Connector Usage: | Backplane |
Moisture Sensitivity Level (MSL): | -- |
Part Status: | Active |
Lead Free Status / RoHS Status: | -- |
Packaging: | Bulk |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
10113947-T0C-70B Application Field and Working Principle
Backplane connectors are a type of specialized electrical connectors that are used to connect two or more printed circuit boards (PCBs) together. The 10113947-T0C-70B, commonly referred to as a "dual inline memory module" (DIMM), is a popular type of backplane connector that is used in various types of computer systems to enable communication between the CPU and memory. This article will discuss the application field and working principle of the 10113947-T0C-70B.
Application Field of 10113947-T0C-70B
The 10113947-T0C-70B is a type of backplane connector specifically designed for use in computer systems. It is most commonly used in desktop and laptop computers, but can also be found in some small form factor systems such as tablets or smartphones. The DIMM is designed to enable the connection of the central processing unit (CPU) and memory on a single PCB, which is beneficial in terms of maximizing space and performance. In addition, the DIMM is designed to enable up to four data channels, which allows for increased data throughput speed.
Working Principle of 10113947-T0C-70B
The 10113947-T0C-70B has several features that allow it to achieve its goal of providing a powerful connection between the CPU and memory. First, it has an electrically isolated ground plane that serves as a buffer between the two components, preventing interference from one component to the other. Secondly, the DIMM has a patented "floating pin" technology that ensures that the connection between the components is secure and reliable. Finally, the DIMM is designed to be highly-flexible, allowing it to be installed in any orientation or at any angle that may be necessary for the application.
In addition, the 10113947-T0C-70B has an improved data transfer rate thanks to its increased number of pins (up to 70). This allows for a higher data throughput, which is beneficial for applications that require high-speed communication between the CPU and memory. Finally, the DIMM has a low electrical resistance, meaning that it is less likely to experience electrical interference or power issues.
Conclusion
The 10113947-T0C-70B is a type of backplane connector that is specifically designed for use in computer systems to enable the connection of the CPU and memory. It is designed with features such as an electrically isolated ground plane, patented “floating pin” technology and increased number of pins for faster data transfer, which make it an ideal solution for computer systems that require high-speed data communication between the CPU and memory.
The specific data is subject to PDF, and the above content is for reference
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