
Allicdata Part #: | 10113949-L0E-30DLF-ND |
Manufacturer Part#: |
10113949-L0E-30DLF |
Price: | $ 0.00 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Amphenol FCI |
Short Description: | XCEDE 3W LEFT 2PVH 8COL |
More Detail: | N/A |
DataSheet: | ![]() |
Quantity: | 1000 |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
1 +: | 0.00000 |
Number of Columns: | 8 |
Voltage Rating: | -- |
Operating Temperature: | -55°C ~ 85°C |
Material Flammability Rating: | UL94 V-0 |
Current Rating: | -- |
Color: | Gray |
Contact Finish Thickness: | 30.0µin (0.76µm) |
Contact Finish: | Gold or Gold, GXT™ |
Features: | -- |
Contact Layout, Typical: | 24 Differential Pairs |
Termination: | Press-Fit |
Mounting Type: | Through Hole |
Series: | XCede® |
Number of Rows: | -- |
Pitch: | -- |
Number of Positions Loaded: | All |
Number of Positions: | -- |
Connector Style: | XCede®, Left Wall |
Connector Type: | Header, Male Pins and Blades |
Connector Usage: | Backplane |
Moisture Sensitivity Level (MSL): | -- |
Part Status: | Active |
Lead Free Status / RoHS Status: | -- |
Packaging: | Bulk |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
10113949-L0E-30DLF is a special type of backplane connector, used across multiple industries. This type of connector ensures that signals are able to travel between different internal components, facilitating communication and data transfer.
Backplane connectors are found in a number of specialized applications, as they offer a reliable, high-performance connection viable in highly demanding industrial operations. The 10113949-L0E-30DLF connectors offer a variety of advantages, such as high performance, 360° shielding, and high speed signaling capabilities.
In addition to these primary advantages, the 10113949-L0E-30DLF connectors offer a number of additional features, such as compatibility with standard board-to-board connectors, termination reliability, and vibration resistance. Additionally, these backplane connectors feature a durable construction meant to withstand extreme temperature fluctuations, humidity, and hazardous environments.
The 10113949-L0E-30DLF backplane connectors are primarily used in internal communication applications in Automotive, Industrial, Networking, and Telecommunication fields. These connectors are designed with the goal of providing high performance connections in these environments. Some of the specific applications that make use of the 10113949-L0E-30DLF include automotive communication modules, cloud storage and communication systems, data acquisition systems, HDTV signal processing and transmission systems, medical imaging systems, multiplexed I/O modules, power distribution systems, remote monitoring and control systems, and wireless communication systems.
The 10113949-L0E-30DLF backplane connectors are designed for easy termination and removal. This makes them ideal for applications where the connection must be frequently broken, such as testing or maintenance operations. The high performance of these connectors also ensures that little to no signal degradation occurs during their operation.
The working principle of 10113949-L0E-30DLF connectors is similar to that of other backplane connectors. They make use of a series of prongs – both male and female – to create accurate connections between components. The connectors are extremely durable and reliable, and have been tested to withstand the rigors of a number of operating conditions. They can even be connected and disconnected under power without risking damage to the circuits they are connected to.
To ensure that the performance of the 10113949-L0E-30DLF backplane connectors is up to par with requirements, they are subjected to rigorous testing. This includes tests on circuit performance, mechanical strength, vibration resistance, temperature range, and humidity resistance.
In conclusion, 10113949-L0E-30DLF backplane connectors are specialized connectors with a variety of advantages, making them ideal for highly demanding applications. They are designed to provide high performance connectivity between components, while also being able to withstand harsh environments and frequent removal.
The specific data is subject to PDF, and the above content is for reference
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