10120124-E0E-20DLF Allicdata Electronics
Allicdata Part #:

10120124-E0E-20DLF-ND

Manufacturer Part#:

10120124-E0E-20DLF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: 3P 8C 2W VERT XCHD LEFT WK
More Detail: N/A
DataSheet: 10120124-E0E-20DLF datasheet10120124-E0E-20DLF Datasheet/PDF
Quantity: 1000
Moisture Sensitivity Level (MSL): 1 (Unlimited)
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Number of Columns: 8
Voltage Rating: --
Operating Temperature: --
Material Flammability Rating: UL94 V-0
Current Rating: --
Color: Black
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Finish: Gold or Gold, GXT™
Features: --
Contact Layout, Typical: 24 Signal Pairs, 28 Ground
Termination: Press-Fit
Mounting Type: Through Hole
Series: XCede®
Number of Rows: --
Pitch: --
Number of Positions Loaded: All
Number of Positions: --
Connector Style: XCede®, Guide Left
Connector Type: Header, Male Pins and Blades
Connector Usage: Backplane
Moisture Sensitivity Level (MSL): --
Part Status: Active
Lead Free Status / RoHS Status: --
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Backplane connectors come in a variety of forms and are designed to accommodate numerous functions and applications. The 10120124-E0E-20DLF is a specialized type of connector specifically designed with both high speed and high density requirements in mind. It is commonly used in a wide array of applications such as high-speed embedded computing, communication equipment, and even cutting-edge consumer electronics devices. This article will focus on the 10120124-E0E-20DLF connector and explore its various applications fields and working principles.

Applications Fields

The 10120124-E0E-20DLF connector can be used in multiple application fields, such as in high-speed embedded computing, communications equipment, and even in consumer electronics. It is suitable for high speed data transfer and signal transmission applications in prototyping and development applications, It is also used in general system integration in the fields of robotics, instrumentation, automation, and medical imaging. Additionally, it can be used for backplane interconnects in telecom and test & measurement.

Features and Benefits

The 10120124-E0E-20DLF connector features a number of benefits that make it particularly attractive for use across diverse application fields. Most notably, it offers 40 Gbps data rate and allows up to 40 high-speed differential pairs in an extremely small form factor. It also offers improved electromagnetic compatibility (EMC) to minimize interference, and is highly reliable, with a 50,000 mating cycles durability rating. This connector is designed to remain stable under severe conditions such as high temperatures or exposure to shocks and vibrations.

Design

The 10120124-E0E-20DLF is a connector based on a stackable modular design. It has a 12-row split design that allows for quick and easy installation of boards or modules without any need for external cabling. It also comprises several contact design variants, including high-speed differential pairs, power and signal contacts. The design of the connector makes use of a center position key for enhanced mating accuracy and dependability.

Working Principle

The 10120124-E0E-20DLF uses a technology called EMI/RFI shielding in order to minimize interference from electromagnetic and radio-frequency sources. This technology works by creating a Faraday cage-like structure around the signal traces on the board, which can protect against external noise, thus ensuring reliable data transfer and signal integrity. The connector is also designed to provide robust mechanical stability and offers a high level of protection against shocks, vibrations, and other physical stressors.

Conclusion

In conclusion, the 10120124-E0E-20DLF is a specialized backplane connector that offers both high speed and high density requirements in a stackable modular design. Its design features immunity from electromagnetic and radio-frequency interference along with mechanical protection and improved accuracy and reliability. With its wide range of applications and superior performance, it is an ideal choice for a variety of applications, from embedded computing and consumer electronic devices to telecom and test & measurement.

The specific data is subject to PDF, and the above content is for reference

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