
Allicdata Part #: | 10120126-10J-30DLF-ND |
Manufacturer Part#: |
10120126-10J-30DLF |
Price: | $ 0.00 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Amphenol FCI |
Short Description: | 4P 4C 4W VERT XCHD HDR |
More Detail: | N/A |
DataSheet: | ![]() |
Quantity: | 1000 |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
1 +: | 0.00000 |
Number of Columns: | 4 |
Voltage Rating: | -- |
Operating Temperature: | -- |
Material Flammability Rating: | UL94 V-0 |
Current Rating: | -- |
Color: | Black |
Contact Finish Thickness: | 30.0µin (0.76µm) |
Contact Finish: | Gold or Gold, GXT™ |
Features: | -- |
Contact Layout, Typical: | 16 Signal Pairs, 18 Ground |
Termination: | Press-Fit |
Mounting Type: | Through Hole |
Series: | XCede® |
Number of Rows: | -- |
Pitch: | -- |
Number of Positions Loaded: | All |
Number of Positions: | -- |
Connector Style: | XCede® |
Connector Type: | Header, Male Pins and Blades |
Connector Usage: | Backplane |
Moisture Sensitivity Level (MSL): | -- |
Part Status: | Active |
Lead Free Status / RoHS Status: | -- |
Packaging: | Bulk |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
10120126-10J-30DLF Application Field and Working Principle
10120126-10J-30DL sets applications and production cutting edge capabilities. It is one of the premier solution packages for backplane connections in server form factors. The high-performance modular connection package is designed specifically for larger form factors and dense power backplane applications, such as those found in multi-gigabit RAID systems and supercomputer clusters.
This superior connection solution is based on what’s known as Lever Lock™ technology. This advanced technology is a standardized recipe for the installation, exchange, and removal of components into cabled and/or embedded backplanes. This allows users to effortlessly engage and disengage the various elements of a given backplane without having to deal with disconnection tangles and associated frustration. The main advantage of this technology is that it eliminates the need to apply hardware and manual intervention when exchanging componentry.
Additionally, the 10120126-10J-30DL features an enhanced abrasion-resistant design for better tolerance under environmental and mechanical stressors. With its high-temperature aluminum die-casting, the unit also provides superior EMI shielding, making sure that the system remains free from electromagnetic interference (EMI) and crosstalk. This ensures that the system operates optimally, with maximum efficiency and reliability.
Moreover, the 10120126-10J-30DL is characterized by a low-profile form factor that produces minimal drag. Designed for continuous and extended operation, the high-power options of this connection package further provide longer lifespan compared to other similar solutions. This prolonged lifecycle increases system ROI and allows for reliable and consistent connection performance over time.
Lastly, the 10120126-10J-30DL is provided with a built-in locking system. This feature makes sure that components are held securely in place, preventing inadvertent disengagement and allowing for more dependable transfer of data. All these features and benefits combine to make the 10120126-10J-30DL a robust and reliable interface that is well-suited for both high-power applications and more complex systems.
Summarizing, 10120126-10J-30DL is a reliable and powerfully efficient backplane connector that is ideal for use in large form factors and densely populated powers backplane systems. Its advanced Lever Lock™ Technology simplifies engagement ad disengagement of components while providing extra protection from EMI and crosstalk. Additionally, its low-profile design, enhanced abrasion resistance, and secure locking system all guarantee top-notch performance over time. The 10120126-10J-30DL is truly a robust and reliable backplane connector solution that sets industry standards for durability, functionality, and performance.
The specific data is subject to PDF, and the above content is for reference
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