Allicdata Part #: | 10120128-G0C-10DLF-ND |
Manufacturer Part#: |
10120128-G0C-10DLF |
Price: | $ 0.00 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Amphenol FCI |
Short Description: | 4P 6C 2W VERT XCHD LEFT WK |
More Detail: | N/A |
DataSheet: | 10120128-G0C-10DLF Datasheet/PDF |
Quantity: | 1000 |
Moisture Sensitivity Level (MSL): | 1 (Unlimited) |
Lead Free Status / RoHS Status: | Lead free / RoHS Compliant |
1 +: | 0.00000 |
Number of Columns: | 6 |
Voltage Rating: | -- |
Operating Temperature: | -- |
Material Flammability Rating: | UL94 V-0 |
Current Rating: | -- |
Color: | Black |
Contact Finish Thickness: | 30.0µin (0.76µm) |
Contact Finish: | Gold or Gold, GXT™ |
Features: | Key |
Contact Layout, Typical: | 14 Signal Pairs, 27 Ground |
Termination: | Press-Fit |
Mounting Type: | Through Hole |
Series: | XCede® |
Number of Rows: | -- |
Pitch: | -- |
Number of Positions Loaded: | All |
Number of Positions: | -- |
Connector Style: | XCede®, Guide Left |
Connector Type: | Header, Male Pins and Blades |
Connector Usage: | Backplane |
Moisture Sensitivity Level (MSL): | -- |
Part Status: | Active |
Lead Free Status / RoHS Status: | -- |
Packaging: | Bulk |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The 10120128-G0C-10DLF is a specialized backplane connector that occupy a unique space in the world of interconnect solutions. It is a single row board-to-board plug system created for high density applications that require superior oscillation, shock and vibration performance without compromising on electrical contact reliability.
This highly reliable interconnect is designed for system architecture, where it performs many of the same functions as a backplane, commonly found in System in Package (SiP) designs. The typical application fields found for these robust points of contact are in the telecommunications, military and aerospace, medical, industrial and automotive electronics industries.
The connector provides a robust connection between two printed circuit boards. It is configured for use in high speed differential systems, involving twisted pairs or multipair cables.
It is different from the traditional backplane in that it is small, light and operates on low power. It\'s easy to install and boasts a high number of cycles with minimal performance degradation. It can also handle very low impedance signals allowing a high density interconnection.
The 10120128-G0C-10DLF backplane connector features ground contact technology with a hermaphroditic mating pattern. The signal contacts are registered simultaneously with a single plunger mechanism which help ensure proper contact alignment with minimal misalignment.
The terminations are made from beryllium-copper in U-shaped design which provide robust electrical and mechanical characteristics. The design of these contacts also facilitate extremely parallel mating as forced is distributed evenly across the pins.
The backplane connector is further equipped with an anti-misalignment mechanism which can detect and reduce the severity of misalignment during mating. The connector also has a self-cleaning mechanism to help increase system integrity.
The 10120128-G0C-10DLF backplane connector is equipped with an OSL Jacket which prevents water ingress and offers superior strain relief under high mechanical shock, vibration and temperature. It also features an improved grounding system for reliable performance under unfavorable environmental conditions.
The robust design of the connector allows for longer impacts and greater shock and vibration resistance than is possible with traditional backplane connectors. In addition, the connector boasts an exceptional signal integrity performance with high frequency signals and cross talk prevention.
The 10120128-G0C-10DLF backplane connector is a reliable and effective solution for high performance applications in a range of industries. Its single row board-to-board plug system, relatively small footprint, robust electrical and mechanical capabilities, and improved grounding system make it a top choice when it comes to providing robust connection points between printed circuit boards.
The specific data is subject to PDF, and the above content is for reference
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