10120128-G0C-70DLF

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World-renowned electronics manufacturer Molex has released the new 10120128-G0C-70DLF backplane assembly. This backplane connector product was designed to give superior performance in specialized applications. It provides an exceptional balance of power, thermal management, and electrical design, making it the ideal choice for a variety of difficult tasks. As the Internet of Things (IoT) continues to evolve, the need for reliable, secure connections increases. Devices and components must have the ability to link up and communicate with each other without fear of compatibility or performance issues. Molex’s 10120128-G0C-70DLF backplane connector can provide this important service.

The 10120128-G0C-70DLF is a high-performance backplane assembly. It supports multiple power and ground bus configurations, providing power to connected devices or components. It is also capable of bearing high frequency signals over long distances without signal degradation. The assembly\'s combination of flexibility, durability, and power make it the perfect choice for a range of purposes.

The most common application for Molex\'s 10120128-G0C-70DLF is industrial automation. This backplane assembly is ideal for controlling and monitoring process automation systems, as well as for powering and managing peripheral components such as motors, valves, and other electrical pieces. The assembly is also well-suited for use in data centers, where it can be utilized to power up and connect racks of servers and other devices. Lastly, the 10120128-G0C-70DLF can be an excellent choice for controlling and powering industrial machinery, such as robots.

The Molex 10120128-G0C-70DLF backplane is built with industry-leading components. The assembly utilizes a 0.020”” pin, LED-compatible, and high-performance printed circuit board (PCB) for superior performance. The backplane also features gold plating over copper pins for improved signal integrity and longevity. Additionally, the assembly has strong strain relief capabilities, reducing stress on connected components. Molex panels are thermoformed, using high-temper polycarbonate, for long-lasting high-performance protection.

For installation, Molex\'s 10120128-G0C-70DLF backplane assembly utilizes a reliable, universal connection interface. This makes the assembly ideal for use in a variety of environments. Molex\'s innovative PICO-CLASP locking system is also used to provide a secure connection between the backplane and panel. The locking system provides an audible click and a secure, zero-clearance connection.

Molex\'s 10120128-G0C-70DLF backplane is a versatile, reliable, and secure solution for a variety of specialized applications. The assembly supports multiple power bus configurations and can bear high frequency signals over long distances without signal degradation. The assembly is also durable and easy to install, making it the perfect choice for industrial automation, data centers, and industrial machinery. With its high performance and versatility, Molex\'s 10120128-G0C-70DLF backplane assembly is a must-have for your specialized application.

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