10120132-V0E-10DLF Allicdata Electronics
Allicdata Part #:

10120132-V0E-10DLF-ND

Manufacturer Part#:

10120132-V0E-10DLF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: 6P 8C 2W VERT XCHD RIGHT WK
More Detail: N/A
DataSheet: 10120132-V0E-10DLF datasheet10120132-V0E-10DLF Datasheet/PDF
Quantity: 1000
Moisture Sensitivity Level (MSL): 1 (Unlimited)
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Number of Columns: 8
Voltage Rating: --
Operating Temperature: --
Material Flammability Rating: UL94 V-0
Current Rating: --
Color: Black
Contact Finish Thickness: 30.0µin (0.76µm)
Contact Finish: Gold or Gold, GXT™
Features: Key
Contact Layout, Typical: 48 Signal Pairs, 52 Ground
Termination: Press-Fit
Mounting Type: Through Hole
Series: XCede®
Number of Rows: --
Pitch: --
Number of Positions Loaded: All
Number of Positions: --
Connector Style: XCede®, Guide Right
Connector Type: Header, Male Pins and Blades
Connector Usage: Backplane
Moisture Sensitivity Level (MSL): --
Part Status: Active
Lead Free Status / RoHS Status: --
Packaging: Bulk 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Backplane connectors are an important type of electrical connectors which are used to form links between boards, backplanes, and modules. They provide a secure connection with better strength and durability as compared to other traditional connector types. The 10120132-V0E-10DLF backplane connector is among the most popular backplane connectors available in the market. This connector is mainly used in industrial environments due to its ultra-micro-miniature design.

The 10120132-V0E-10DLF backplane connector is a multi-pin board-to-board interface connector that is designed for standard SL bus architectures. It is typically used in applications requiring a high density, high reliability, low-power, and high performance board interconnect solution. It is designed to incorporate multiple pins in a compact form factor and is suitable for a variety of applications. Some of these applications include:

  • Industrial Automation and Control
  • Robotics and Automation
  • Medical Systems
  • Wireless Communications
  • Industrial I/O and Sensors

The 10120132-V0E-10DLF backplane connector has several important features. It is a high-density connector with up to 25 contacts per row. It also has a wide power rating of up to 30 amps per pin, providing a reliable solution for power and low voltage applications. It is also designed with a low-profile design which reduces the overall size of the connector. The contact pins are machined from high quality material and they are designed with a signal shield that provides additional resistance to crosstalk. Furthermore, the contact pins have a plated finish which provides improved electrical insulation.

In terms of the working principle of the 10120132-V0E-10DLF backplane connector, it utilizes a standard board-to-board configuration. It is designed to provide a secure connection between two boards, with the high density contact pins making contact with the mating component. The connector is designed so that the contact pins make contact with the mating component in a uniform manner, ensuring maximum contact and electrical connection. Furthermore, the connector’s contact pins are designed with a special surface treatment to ensure that the contacts remain secure.

In conclusion, the 10120132-V0E-10DLF backplane connector is an ultra-micro-miniature connector designed to provide a secure connection between two boards. It is designed with a high density contact pins and wide power rating, providing a reliable and durable connection between two boards. Furthermore, the contact pins are designed with special surface treatments to ensure that the contacts remain secure and the electrical connection remains intact. The 10120132-V0E-10DLF backplane connector is mainly used in industrial applications due to its low profile design and wide range of features.

The specific data is subject to PDF, and the above content is for reference

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