10124556-11JLF Allicdata Electronics
Allicdata Part #:

10124556-11JLF-ND

Manufacturer Part#:

10124556-11JLF

Price: $ 0.00
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: BERGSTIK
More Detail: N/A
DataSheet: 10124556-11JLF datasheet10124556-11JLF Datasheet/PDF
Quantity: 1000
Moisture Sensitivity Level (MSL): 1 (Unlimited)
Lead Free Status / RoHS Status: Lead free / RoHS Compliant
1 +: 0.00000
Stock 1000Can Ship Immediately
$ 0
Specifications
Number of Columns: 8
Voltage Rating: --
Operating Temperature: -55°C ~ 85°C
Material Flammability Rating: UL94 V-0
Current Rating: --
Color: Black
Contact Finish Thickness: --
Contact Finish: --
Features: ExaMax® Guide Right
Contact Layout, Typical: --
Termination: Press-Fit
Mounting Type: Through Hole, Right Angle
Series: ExaMAX®
Number of Rows: 20
Pitch: --
Number of Positions Loaded: All
Number of Positions: 160
Connector Style: High Speed
Connector Type: Receptacle, Female Sockets
Connector Usage: Daughtercard
Moisture Sensitivity Level (MSL): --
Part Status: Active
Lead Free Status / RoHS Status: --
Packaging: Bulk 
Description

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Backplane Connectors - Specialized

The 10124556-11JLF is a specialized connector type designed for use as a backplane connector. The product is manufactured by the Molex company and is designed for high-speed applications while providing reliability, robustness and improved performance.

The Molex 10124556-11JLF has a number of features and technologies that give it advantages over other types of backplane connectors. The connector is rated for up to 20Gb/s, making it suitable for many high-speed applications that require data transfer at speeds up to 10 Gbps. In addition, it has a unique design that allows for a greater number of contacts than other backplane connectors, making it suitable for many applications that require density of contacts.

The 10124556-11JLF is made of high-temperature plastic that is resistant to oxidation and corrosion. It has an integrated ground contact that provides good electrical and mechanical shielding, reducing noise and ensuring that signals are transmitted properly. The connector also features a unique clip-in contact system that ensures a secure connection.

The 10124556-11JLF backplane connector can be used in a variety of different applications, such as telecom, datacom, industrial, automotive, medical and consumer electronics. It is designed to work with a variety of different backplane applications including CompactPCI®, CompactPCI® Express, Ethernet, SATA, USB 3.0, Infiniband and more. It is suitable for use in many different types of applications including computer motherboards, cell phones and other digital media devices.

The working principle of the 10124556-11JLF backplane connector is quite simple. The connector is a plug-and-socket interface, meaning that it consists of two halves, one being the plug and the other being the receptacle. By inserting the plugs into the receptacles, the electrical connections between them are established. This allows current to flow from the pin contacts of the plugs to the corresponding contacts of the receptacles, creating an electrical pathway between them. This electrical pathway is then used to transfer data or power between the two components.

In order to maximize the performance of the 10124556-11JLF backplane connector, several features have been incorporated into the design. For instance, the connector features a high-speed signal path which increases the amount of data that can be transferred through the connector. Additionally, the contact points have been designed to prevent electric shocks and ensure a low electrical resistance, which helps to protect the components connected to the connector.

The Molex 10124556-11JLF backplane connector is an ideal product for a variety of applications, ranging from telecom to consumer electronics. The connector offers a reliable connection with high-speed performance and a large number of contact points, making it well-suited for many high-speed applications. Additionally, the design features an integrated ground contact and clip-in contact system that ensure a secure connection, providing improved reliability and robustness for the application.

The specific data is subject to PDF, and the above content is for reference

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