10124632-0211C03LF

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Memory Connectors - Inline Module Sockets are designed to transfer data between electronic components. The 10124632-0211C03LF inline module sockets is especially equipped with long tail design which makes it suitable for surface mount applications as well. It is mainly used in the fields of personal computers, laptops, cellular phones, consumer electronics and medical imaging equipment.

The 10124632-0211C03LF socket is specifically engineered with an air gap that provides superior signal integrity and improved crosstalk performance. It provides excellent contact reliability and offers the highest density of contact points in the industry. The socket is also designed for high temperature operation up to 140°C and comes with an operating voltage rating of 5V.

The 10124632-0211C03LF socket operates by establishing electrical connections between the contacts on the backplane and the pins on the module. The socket has two main parts - the backplane and the memory module. The backplane provides a common platform for the various components to be connected. The memory module is then inserted into the backplane to create the connection between these components. Once the connection has been made, the data is then transferred through the interconnects on the backplane.

The 10124632-0211C03LF socket features a spring loaded mechanism in the connectors. This ensures that the connections are well-secured and remain in place even under high temperature and vibration conditions. The contacts are also equipped with conductive elastomer that further improves contact reliability. The socket is designed for use in extreme temperature and vibration environments.

The 10124632-0211C03LF socket provides reliable data transfer for applications involving high data rates. This makes it ideal for use in various digital applications such as routers, switches, ATM machines, and modems. The socket is also designed to meet the requirements in various network applications like SAS, PCI Express, SATA, and USB. It is also suitable for use in cell phones, tablets, and other portable electronics.

In summary, the 10124632-0211C03LF is an inline module socket designed to provide reliable data transfer for various digital applications. It is equipped with an air gap that ensures superior signal integrity and improved crosstalk performance. The socket is designed for high temperature operation up to 140 degrees Celsius and offers the highest density of contact points in the industry. It is also designed to be used in extreme temperature and vibration environments and is suitable for a wide range of digital applications.

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