10124677-0301C03LF

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Memory Connectors, particularly Inline Module Sockets, are devices used for establishing electrical connections between two different memory components. The part number 10124677-0301C03LF is part of a product series supplied by TE Connectivity, and is an example of an Inline Module Socket. This article covers the application field and working principle of this particular device.

Application Field and Benefits

Inline Module Sockets are ideal for applications that require a memory connection with high reliability and critical timing constraints. The 10124677-0301C03LF offers a high number of contacts in a compact package size, as well as enhanced durability for increased lifetime and reliable performance, making it suitable for a range of tasks. It can be used in a range of industries, such as military, automotive, consumer electronics, and industrial, making it a versatile device with a wide range of potential applications.

The socket is designed to meet the stringent requirements of automotive and military applications. It has a high temperature range, from -55 to 125°C, and an operating current of 1A. It is compliant with the RoHS-2 Directive and has a UL recognized current rating of 2A. This makes it ideal for automotive, aerospace and high-reliability applications.

Working Principle

Inline Module Sockets use a contact pattern that is recognisable in most memory devices. This contact pattern ensures that each pin of the socket can be connected to the corresponding pin of the device in order to ensure a reliable connection. The contact pattern may also include some additional pins which may be used for other purposes, such as power and ground, signal integrity or data transfer.

The 10124677-0301C03LF is a compact socket with a total of 12 pins. These 12 pins are arranged in a pattern as described above, with 8 pins dedicated to memory function, 2 additional pins dedicated to power and ground, and the final two pins dedicated to signal integrity or data transfer. The signal integrity and data transfer pins are protected against Electrostatic Discharge (ESD) and current limiting protection. This ensures that any poor contact between pins or any over-current conditions will not damage the application or the device itself.

In addition, the socket has a 40µm minimum gold contact plating. This plating ensures that the connection between the socket and the device is reliable, and can withstand high temperatures. The socket also has an additional benefit of having an exposed solder joint, which can be used to secure the device to the socket.

Conclusion

In summary, the TE Connectivity 10124677-0301C03LF Inline Module Socket is designed for a wide range of memory applications. It offers superior features such as a high temperature range, RoHS-2 compliance, and current-limiting protection for superior reliability and durability. It also has a 40µm minimum gold contact plating for improved device connection, and an exposed solder joint to secure the connection. With its versatile application possibilities and reliable performance, the 10124677-0301C03LF is an excellent choice for memory application requirements.

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