10127714-111LF

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10127714-111LF is a specialized backplane connector, capable of being used in a diverse range of applications. This article shall look to provide an overview of these application fields, and explain the working principle behind such a type of connector.

Overview

10127714-111LF provides industry standard connectivity for any size of board, acting as the link between different protocol boards. It can be used to interconnect boards with different stack heights, simplifying design processes. It is an ideal connector for applications such as power cards and server boards. Manufactured with durability and strength in mind, it is manufactured to the highest quality control standards.

Working Principle

The 10127714-111LF backplane connector\'s working principle is founded upon the wafer contact structure-it is an array of horizontally mounted pins across which signals pass via array mating and un-mating. It is a two-piece connector comprising of a top and bottom part, which when attached, form a locking mechanism. This ensures secure connections throughout the lifetime of the connector. In addition, it also houses a UV protection that prevents corrosion from forming, which is essential for reliable, long-term connections.

The design of the 10127714-111LF also enables it to cope with very high insertion cycles. It has a superior spring force that ensures a quick and reliable connect, which is essential for high-speed and high-density applications. Its stability also ensures that the pins remain in contact even under extreme temperatures and severe vibration.

Advantages

The 10127714-111LF specialized backplane connector provides a number of advantages that make it highly suitable for a variety of applications. Firstly, the design ensures that the connector remains secure during its lifetime. This protects against signal discrepancies due to vibration, shock or temperature fluctuations. The UV protection also prevents corrosion from occurring, helping to ensure reliable and long-term connections.

Next, the spring force allows for quick and reliable connection, making it ideal for high-speed and high-density applications. This ensures that there is no signal interruption and data integrity is maintained. Finally, the 10127714-111LF has superior EMI/EMC protection, which reduces the potential of interference and the risk of electromagnetic induction.

Conclusion

The 10127714-111LF has a wide range of applications due to its high performance and reliability. It is ideal for use in power cards, server boards and other board-level connections that require secure connections. Its superior design features, including UV protection and spring force connection, make it suitable for both high-speed and high-density applications. With superior EMI/EMC protection, it offers reliable connections in a range of environments.

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