10128622-000416KLF

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A backplane is a printed circuit board found inside most modern electronic computers, servers, and networking devices, providing a physical interface between several interconnected printed circuit boards. This is usually accomplished through a specialized backplane connector, such as the 10128622-000416KLF. In this article, we will discuss the application fields and working principles of this particular backplane connector.

Application Fields

The 10128622-000416KLF backplane connector is typically found in high-speed computing and data transmission systems. It is used for applications that require high speed data transmission and reliable, low-noise connections, such as in the following:

• High-speed servers
• Switched fabric networks
• High-speed converged networks
• High-speed switching applications
• High-end mobility networks

The 10128622-000416KLF backplane connector is engineered to handle a wide range of current levels and speeds, making it an ideal choice for mission-critical applications.

Working Principle

The working principle of the 10128622-000416KLF backplane connector involves its ability to transfer high current levels and signals reliably over long distances without any signal loss or noise. It ensures low-inductance connection between multiple boards simultaneously, while maintaining low impedance characteristics.

The 10128622-000416KLF connector is designed with a current rating of up to 20A, ensuring it can easily transfer large amounts of current over multiple devices. It is also designed to offer excellent temperature tolerance and generate minimal crosstalk.

The 10128622-000416KLF backplane connector is available in both through-hole and surface-mount packages. This allows for easy integration into most computing systems and makes it easy to install and maintain.

Conclusion

The 10128622-000416KLF backplane connector is an ideal solution for applications that require reliable high-speed data transfer and low-noise connections. Its design ensures low inductance and excellent temperature tolerance, making it an excellent choice for mission-critical applications. Its through-hole and surface-mount packages enable easy integration into existing systems, making it an ideal choice for high-speed computing and data transmission systems.

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