10132798-052100LF Allicdata Electronics
Allicdata Part #:

609-5227-2-ND

Manufacturer Part#:

10132798-052100LF

Price: $ 0.49
Product Category:

Connectors, Interconnects

Manufacturer: Amphenol FCI
Short Description: 50POSITIONING, 2.7MM HEIGHT RECE
More Detail: 50 Position Connector Receptacle, Center Strip Con...
DataSheet: 10132798-052100LF datasheet10132798-052100LF Datasheet/PDF
Quantity: 4800
1200 +: $ 0.43838
2400 +: $ 0.39728
6000 +: $ 0.38358
8400 +: $ 0.36441
12000 +: $ 0.35618
Stock 4800Can Ship Immediately
$ 0.49
Specifications
Series: BergStak®, MezzSelect™
Packaging: Tape & Reel (TR) 
Part Status: Active
Connector Type: Receptacle, Center Strip Contacts
Number of Positions: 50
Pitch: 0.020" (0.50mm)
Number of Rows: 2
Mounting Type: Surface Mount
Features: Board Guide, Solder Retention
Contact Finish: Gold
Contact Finish Thickness: 1.00µin (0.025µm)
Mated Stacking Heights: 5mm, 5.5mm, 6mm
Height Above Board: 0.106" (2.70mm)
Description

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Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) connectors are widely used in many electronics and engineering applications. They are used to interconnect various components or devices, allowing for communication between them. The 10132798-052100LF is a type of mezzanine (board to board) connector from MOLEX. This article will provide an overview of the types of applications as well as how it works.

The 10132798-052100LF has a wide range of applications. It is designed primarily for applications where two or more printed circuit boards need to be connected together. These connectors are commonly used in consumer electronics such as computers, mobile phones, digital cameras, and other digital devices. This type of connector is also used in industrial, automotive, and medical applications where boards need to be connected together. The connector is versatile and offers a variety of possible applications.

The 10132798-052100LF is a two-level mezzanine system, which consists of an upper and lower level. The bottom level is referred to as the Motherboard and the top level is referred to as the Daughterboard. The Motherboard is the baseboard that powers the system and the Daughterboard is designed to fit onto the Motherboard in order to provide additional functionality. The connector is designed to have a compact form factor, which allows for flexible designs and a lower total cost due to less required space. The connector is designed to fit into tight spaces with ease.

The 10132798-052100LF connector is designed to have a high performance, robust signal integrity, and reliable contact points. The contact points are specially designed for high power environment and are gold-plated for improved corrosion resistance. The contacts have a low contact resistance, which ensures that signal loss is minimized. The contact points are also designed to be low profile for better physical connection and easier board stacking. This helps to provide a more reliable connection over time.

The 10132798-052100LF is a high-density, high-performance interconnect solution. It has a small form factor, which is ideal for space-constrained designs. It also has high impedance shielding, which helps to provide enhanced EMI protection. The connector is also RoHS compliant, making it suitable for long-term use and environmentally friendly applications. The connector uses a locking mechanism, which ensures that a strong connection is maintained. The locking mechanism also helps to reduce any potential damage due to mechanical shock or vibration.

In summary, the 10132798-052100LF is a type of mezzanine (board to board) connector from MOLEX. It is designed for applications where two or more printed circuit boards need to be connected together. The connector is designed to provide enhanced signal integrity and reliable contact points. It also has a compact form factor, allowing for flexible designs and a lower total cost. The connector has a high impedance shielding, RoHS compliance and a locking mechanism, ensuring a strong and reliable connection over time. This makes it a great solution for a variety of electronics and engineering applications.

The specific data is subject to PDF, and the above content is for reference

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