10137559-102LF

10137559-102LF is one of the products in the family of modular connectors - plugs. It is designed for remote telemetry and mobile communication data applications. The product has a very compact and slim package, which makes it ideal for many embedded applications with limited space. It offers a wide frequency bandwidth for both voice and data communications.

Characteristics

The 10137559-102LF features a robust design and construction with a wide range of compatibility between contacts and plugs. The plug has an overmolded, high-performance resin body construction that meets MIL-STD-883D and DEF STAN 59-18 requirements. Pre-loaded high-performance springs allow for secure mating while providing a low-force connection. It has a 50 ohm impedance, 7/16” front-operative connector, 6.5 mm contact spacing, 50-ohm signal impedance and up to 33 dB return loss. The maximum insertion loss is 0.2 dB and the typical operating temperature range is from -55°C to +125°C.

Application Field

The 10137559-102LF is suitable for remote telemetry, mobile communication data, 3G/4G/5G cellular, GPS, and other wireless telecommunication systems. It is designed to meet the stringent requirements for high speed data transmission rates found in embedded systems for telemetry and mobile communications.

Working Principle

The 10137559-102LF interconnect system is designed for reliable connections under a wide range of high-frequency signal conditions. The connector provides a low-impedance path for signal transmission and ensures reliable signal transmission over a wide frequency range. The design also ensures that the contact points remain securely connected under a wide range of vibration, shock and temperature extremes. The compression interface between the contact and the plug body provides a robust, low-friction mating interface that minimizes contact resistance and ensures consistency in mating performance.

Conclusion

The 10137559-102LF is a rugged and reliable interconnect system designed for remote telemetry and mobile communications applications. Its high-performance design and construction make it suitable for a wide range of high-speed data transmission rates in embedded solutions. The low-impedance signal path and robust, low-friction contact points ensure reliability and consistency in performance.