11-0503-31

Contact Material - Mating:	Beryllium Copper
Housing Material:	Polyamide (PA), Nylon, Glass Filled
Contact Material - Post:	Brass
Contact Finish Thickness - Post:	10.0µin (0.25µm)
Contact Finish - Post:	Gold
Pitch - Post:	0.100" (2.54mm)
Termination:	Wire Wrap
Features:	--
Mounting Type:	Through Hole
Series:	0503
Contact Finish Thickness - Mating:	30.0µin (0.76µm)
Contact Finish - Mating:	Gold
Pitch - Mating:	0.100" (2.54mm)
Number of Positions or Pins (Grid):	11 (1 x 11)
Type:	SIP
Part Status:	Active
Packaging:	Bulk

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Sockets for ICs, TransistorsA socket, also known as an integrated circuit (IC) package, provides electrical connections between an integrated circuit and a printed circuit board (PCB) or other electronic device. The socket is a mechanical and electrical interface which provides a secure electrical connection between the IC and the board or device.There are five types of sockets for ICs and transistors. They are typically arranged in a number of ways, depending on the application. For example, they may be arranged in dual inline packages (DIPs), single in line packages (SIPs), single in line memory (SIMs) or through-hole packages (THPs) to name just a few.A number of different materials are used for sockets for ICs and transistors. Common materials include ceramic, plastic, metal and capacitors. The choice of material affects the heat dissipation of the socket as well as the frequency response of the device.The working principle of this kind of Socket for ICs and transistors is rather simple. Upon the placement of the integrated circuit onto the socket, contacts and pins on the integrated circuit and the substrate respectively make contact and an electrical connection between the two is established. This not only establishes a mechanical connection but also a highly reliable electrical connection. This is because the contacts for both the integrated circuit and the substrate are both designed to be extremely small and precise, such that when they make contact they produce an electrical connection that is resilient to abrasion and shear force.Each component of a socket for ICs and transistors is designed to provide a secure, reliable electrical connection between the integrated circuit and the substrate. The electrical connection is made using small metal contacts on the integrated circuit that are surfaced mounted onto the socket board. The contacts are microscopic in size with a diameter of 0.5 mm or less and a pitch size of 0.5 mm or less.The contacts are placed onto the socket board in a number of different ways. The contacts are typically arranged in a straight line or in a circle around the socket board. The contacts are also typically soldered to the substrate for added security. The contacts can also be designed to handle higher voltages or currents, allowing them to be used for applications such as power applications.The sockets also allow the ICs and transistors to be used in a range of different thermal environments. All of the components on the socket board are designed to ensure the highest level of reliability and performance. This includes the thermal interface materials which absorb heat from the IC’s or transistors and reduce the temperature of the board. The materials also buffer the heat dissipation, spreading it out across the surface of the board.In summary, Sockets for ICs and transistors provide reliable electrical connections between ICs and PCBs or other electronic devices. The sockets are designed to handle higher voltages and currents and provide a highly reliable connection. They can also be designed for a range of different thermal environments and materials. The components on the socket board are designed to absorb heat and buffer the heat dissipation to ensure the highest level of reliability and performance.

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