110-43-320-41-001000 Allicdata Electronics
Allicdata Part #:

ED90036-ND

Manufacturer Part#:

110-43-320-41-001000

Price: $ 1.15
Product Category:

Connectors, Interconnects

Manufacturer: Mill-Max Manufacturing Corp.
Short Description: CONN IC DIP SOCKET 20POS GOLD
More Detail: N/A
DataSheet: 110-43-320-41-001000 datasheet110-43-320-41-001000 Datasheet/PDF
Quantity: 4616
1 +: $ 1.03950
10 +: $ 0.94311
25 +: $ 0.88528
50 +: $ 0.84685
100 +: $ 0.80835
250 +: $ 0.73138
500 +: $ 0.67363
1000 +: $ 0.57740
2500 +: $ 0.53890
Stock 4616Can Ship Immediately
$ 1.15
Specifications
Termination: Solder
Contact Resistance: --
Current Rating: 3A
Material Flammability Rating: --
Termination Post Length: 0.125" (3.18mm)
Operating Temperature: -55°C ~ 125°C
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Series: 110
Features: Open Frame
Mounting Type: Through Hole
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 20 (2 x 10)
Type: DIP, 0.3" (7.62mm) Row Spacing
Part Status: Active
Packaging: Tube 
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Sockets for ICs, Transistors, more commonly known as 110-43-320-41-001000 application field and working principle, are a type of electrical connectors that allow for individual electrical components to be easily connected and interchanged. These connectors come in many shapes and sizes and can bePlug and socket used for many types of applications, from simple low power logic signals to high voltage power supplies.

The most common socket types for ICs, transistors and other integrated circuits are pin-grid arrays (PGAs), dual inline packages (DIPs) and surface mount packages (SMDs). These sockets have a variety of different pin configurations, and each type is designed specifically for the type of component it is used for. Pin-grid array sockets have a single row of pins that are arranged in a rectangular grid pattern. Dual inline packages (DIPs) have two rows of pins facing each other that line up in a rectangle. Surface mount packages (SMDs) are soldered directly onto the circuit board surface.

In the 110-43-320-41-001000 application field, these sockets typically serve as the interface between integrated circuits and external components and devices. They feature contacts that carry electrical signals as well as provide guidance and support for the socketed component. In order to ensure that the contact grip the pins in the socket correctly, the socket has to be constructed with some flexibility and resiliency. This is usually achieved with precision machining and injection molding techniques. The presence of a spring-loaded component keeps the socket\'s pins secure in the housing and ensures proper connection with the integrated circuit pins.

The working principle behind 110-43-320-41-001000 application field and working principle is relatively simple. When a component needs to be connected to an integrated circuit, it slides into the socket until it is firmly seated. When the component is securely connected, the socket\'s spring contacts make contact with the pins on the integrated circuit, creating electrical continuity between the external device and the integrated circuit. If the integrated circuit is unplugged, the socket will hold the component securely in place so it is not damaged.

The 110-43-320-41-001000 application field and working principle are widely used in many areas such as telecommunications, automotive, aerospace, and consumer electronics. Many of today\'s electronic devices such as smartphones, networking devices, computers, and tablets rely on these advanced connectors to function properly. They are also essential components of many high-tech medical devices. Manufacturers often use high quality materials when creating these sockets in order to ensure that they are durable and long-lasting.

By using these sockets, engineers are able to more easily and effectively manage their integrated circuit usage. They are able to ensure that the device operates properly without any gaps or imbalances, and can easily replace components if necessary. Thanks to the many advances in technology, these sockets have become increasingly versatile and reliable, allowing them to be used in a wide variety of applications.

The specific data is subject to PDF, and the above content is for reference

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