110-47-308-41-105000 Allicdata Electronics
Allicdata Part #:

ED11083-ND

Manufacturer Part#:

110-47-308-41-105000

Price: $ 0.80
Product Category:

Connectors, Interconnects

Manufacturer: Mill-Max Manufacturing Corp.
Short Description: CONN IC DIP SOCKET 8POS GOLD
More Detail: N/A
DataSheet: 110-47-308-41-105000 datasheet110-47-308-41-105000 Datasheet/PDF
Quantity: 129
1 +: $ 0.72450
10 +: $ 0.63441
25 +: $ 0.59724
50 +: $ 0.57242
100 +: $ 0.54747
250 +: $ 0.49770
500 +: $ 0.44793
1000 +: $ 0.39816
2500 +: $ 0.36083
Stock 129Can Ship Immediately
$ 0.8
Specifications
Termination: Solder
Contact Resistance: --
Current Rating: 3A
Material Flammability Rating: --
Termination Post Length: 0.125" (3.18mm)
Operating Temperature: -55°C ~ 125°C
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Series: 110
Features: Open Frame
Mounting Type: Surface Mount
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: Flash
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Number of Positions or Pins (Grid): 8 (2 x 4)
Type: DIP, 0.3" (7.62mm) Row Spacing
Part Status: Active
Packaging: Tube 
Description

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Sockets for ICs, Transistors

The 110-47-308-41-105000 application field and working principle is a form of integrated circuit socketing which provides an solderless means of attaching and detaching integrated circuits (ICs) and transistors. It is used in the fields of industrial control of machinery, scientific analysis and instrumentation, and consumer electronics.

The socket itself is a rectangular, open-ended plastic housing which contains metal contacts that match the IC or transistor pins or legs.The metal contacts can be in either a submerged, partially submerged or non submerged configuration, depending upon the application.

In submerged configuration the metal contacts are completely enclosed in the plastic housing. This type of configuration is commonly used in embedded applications where the contacts are not exposed. The partially submerged type of configuration allows the contacts to protrude beyond the plastic and is used in applications where the contacts are exposed the consumer. The non-submerged configuration is used mainly for ICs in DIP (dual in-line) pin packages.

The 110-47-308-41-105000 application field and working principle also includes the use of clip-on boards. Clip-on boards are placed over the metal contacts and help to provide an electrical connection to the IC or transistor. The clip-on boards are also used to hold the IC or transistor securely in the socket and provide the appropriate alignment.

Once the IC or transistor is in place, a special tool is used to close the plastic housing and ensure a solid connection between the device and the contacts. The special tool helps to ensure that the device is properly aligned and inserted in the socket. This prevents device failure due to misalignment or improper wiring.

The 110-47-308-41-105000 application field and working principle also includes the use of special connectors which can be used to provide power and input/output signals to and from the IC or transistor. Depending on the type of connector used, it is possible to provide power to the device and/or to provide additional I/O signals. These connecters are often used in embedded applications to provide additional functionality and flexibility.

The 110-47-308-41-105000 application field and working principle allows for a wide variety of ICs and transistors to be used in different types of embedded systems and applications. It is easy to use, reliable, and provides a cost effective solution for attaching and detaching ICs and transistors.

The specific data is subject to PDF, and the above content is for reference

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