110-83-210-01-839101

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Sockets for ICs, transistors, and other electrical components provide a means of connecting these components together when building or repairing circuits. They are typically used to extend the contact area between the components and to provide better heat dissipation. 110-83-210-01-839101 sockets are a particular type that are designed for a range of high-density surface mount components.

The socket comes with a two-step soldering and inspection process. Firstly, a resistive soldering system is used to automatically solder the components to the socket body. The soldering system holds the component in place while maintaining contact pressure, and the solder is heated to the correct melting temperature. Additionally, the soldering system inspects the joint quality to ensure a satisfactory electrical connection.

Following the soldering, a quality inspection is then performed to make sure the soldering is correct and that there are no visible problems. This can be done visually or using automated inspection systems. A comprehensive package X-ray inspection is also performed to detect any hidden defects that may be present such as solder balling (where the solder rapidly cools in a ball formation) and incomplete soldering.

The 110-83-210-01-839101 socket is small and compact. Its design makes it suitable for embedding in a variety of applications. Due to its special damping-type design, it can absorb vibration and shocks, resulting in stable performance. The contact force between the components and the socket is also maintained at a high level. This ensures reliable electrical contact even under demanding conditions.

By using this socket in applications such as automotive, military, aerospace, and industrial, it allows for higher pin densities with zero airgap between the body and the contacts. This helps to reduce assembly and mounting costs, which can often be a major cost for high density semiconductor components.

The 110-83-210-01-839101 socket is designed to be compatible with leadless chip carriers (LCCs). It also has a synchronous actuation mechanism which ensures the correct electrical connection for a wide range of packages, including 0.4mm Pitch LQFPs, 0.8mm Pitch TQFPs, and many others. The socket can be connected to the LCCs using a simple connection system, which helps to reduce labor costs as well as ensuring reliable contact.

To sum up, the 110-83-210-01-839101 socket is an excellent choice for a range of automated, high-density electronic components and applications. Its small size and automated inspection process ensure that it provides reliable electrical connections, while its synchronous actuation mechanism ensures compatibility with a wide range of package sizes. Additionally, its damping-type design helps to absorb vibration and shocks, which helps to improve the performance of the components.

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