110-83-642-41-001101

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Sockets for ICs, Transistors:

The application field and working principle of 110-83-642-41-001101 are explored in this article. Specifically, this socket is a type of fine pitch socket for Integrated Circuits (ICs), Transistors, and other semiconductor components. It is widely used in the automotive, industrial, medical, and consumer electronics industries, as well as in a wide variety of other applications.

The most common type of this socket is the BGA or Ball Grid Array style socket, which is designed for use with ICs that have a fine pitch on the underside. The socket has a series of pins that are positioned on the top side of the module, in order to make contact with the IC’s pins. These pins have a pitch that matches the pitch on the IC, thus allowing it to slide securely into the socket. The pins are joined together and connected at the bottom side, in order to create a reliable connection between the IC and the board when used in a BGA format.

Another type of 110-83-642-41-001101 socket is the SSB or Solderless Socket Bridge, which is designed for use with a variety of components, such as ICs, resistors, transistors, capacitors, and LEDs. This type of socket has a bridge at its base, allowing it to be soldered directly to the circuit board. Unlike the BGA socket, the SSB does not have any pins, and instead relies on a solder joint in order to make a connection between the component and the board. This type of socket is used mainly for components that require a higher level of precision when it comes to making a connection with the circuit board.

The working principle of 110-83-642-41-001101 sockets is that they provide a reliable electrical connection between the IC and the board. In the case of the BGA sockets, the pins have been designed to make contact with each of the component’s pins. When the IC is placed in the socket, the pins make contact with the IC pins, allowing an electrical connection to be made. The connection is further secured with the use of a soldered joint at the bottom side of the socket, ensuring a firm and reliable connection.

In the case of SSB sockets, the bridge on the base of the socket makes contact with the board’s pads. This connection is secured with a soldered joint, creating a reliable connection between the component and the board. Both types of sockets are designed to ensure a reliable electrical connection between the IC and the board, while also preventing any damage to the IC.

In summary, 110-83-642-41-001101 sockets are designed for use with a variety of ICs, transistors, and other semiconductor components. The most common type of socket is the BGA or Ball Grid Array style socket, which has pins on the top side that match the pitch of the IC. The SSB or Solderless Socket Bridge is used for components that require a higher level of precision and is connected to the board by a bridge and a soldered joint. The working principle of both types of sockets is that they provide a reliable electrical connection between the IC and the board.

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