
Allicdata Part #: | 110-87-320-41-105101-ND |
Manufacturer Part#: |
110-87-320-41-105101 |
Price: | $ 0.88 |
Product Category: | Connectors, Interconnects |
Manufacturer: | Preci-Dip |
Short Description: | CONN IC DIP SOCKET 20POS GOLD |
More Detail: | N/A |
DataSheet: | ![]() |
Quantity: | 1000 |
380 +: | $ 0.79900 |
Termination: | Solder |
Contact Resistance: | 10 mOhm |
Current Rating: | 1A |
Material Flammability Rating: | UL94 V-0 |
Termination Post Length: | 0.118" (3.00mm) |
Operating Temperature: | -55°C ~ 125°C |
Housing Material: | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
Contact Material - Post: | Brass |
Contact Finish Thickness - Post: | -- |
Contact Finish - Post: | Tin |
Pitch - Post: | 0.100" (2.54mm) |
Series: | 110 |
Features: | Open Frame |
Mounting Type: | Surface Mount |
Contact Material - Mating: | Beryllium Copper |
Contact Finish Thickness - Mating: | Flash |
Contact Finish - Mating: | Gold |
Pitch - Mating: | 0.100" (2.54mm) |
Number of Positions or Pins (Grid): | 20 (2 x 10) |
Type: | DIP, 0.3" (7.62mm) Row Spacing |
Part Status: | Active |
Packaging: | Tube |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
The 110-87-320-41-105101 application field and working principle of sockets for ICs, transistors has been an area of interest for many engineers and researchers. This article will discuss the fundamentals of sockets for ICs, transistors, including their structure, characteristics, and usage.
Definition of Sockets for ICs, Transistors
Sockets for ICs, transistors are also known as pin grid array (PGA) sockets. They are a type of integrated circuit (IC) packaging used with microprocessors, memory chips, and other integrated circuits. A PGA socket is typically composed of a printed wiring board (PWB) that contains pins (usually in a specific configuration and with a specific lead pitch). The socket is designed to allow flexible and safe connection to a compatible IC. It can also be tailored to the specific application’s needs.
Structure and Characteristics of Sockets for ICs, Transistors
PGA sockets are typically constructed from a mixture of metal and plastic materials. Structurally, a PGA socket includes several components such as a base, a top, pins, and a leadframe. The base forms the foundation of the socket and provides a stable surface for the IC. This is typically made of injection-molded plastic or metal. The top acts as a protective cover for the internal components, providing both mechanical and electrical protection.
The pins of PGA sockets are arranged in a specific configuration and have a specific lead pitch pattern. This pattern is tailored to the application, and the pins are generally electrically connected to the base and the IC. The leadframe is responsible for connecting the pins and providing electrical connection throughout the system.
PGA sockets offer several advantages compared to other IC packaging technologies. For example, PGA technology offers higher pin density and low power consumption, since it requires no wires or other interconnects. Additionally, PGA pins are capable of handling more current than other IC packaging technologies, allowing for greater current density in the device. Finally, PGA technology can support a variety of ICs, providing increased flexibility.
Usage and Applications of Sockets for ICs, Transistors
PGA sockets are widely used in various applications. Such applications include memory systems, robotics, medical devices, communication devices, automotive systems, gaming, aerospace, consumer electronics, and many others. In addition, PGA sockets are used with ICs such as microprocessors, memory chips, and other integrated circuits.
PGA sockets offer many benefits for a variety of applications. The small size and low signal-loss permit high-density designs. They are rugged and reliable, making them suitable for rough environments. The smooth pins can provide precise, repeatable mating, which makes them suitable for automated assembly.
In addition to their flexibility, PGA sockets also offer reliability and cost-effectiveness. They can be tailored to the application, such as high temperature, to minimize current leakage. Additionally, since they are single-piece designs, they reduce the cost of assembly and provide a more aesthetically pleasing overall design.
Conclusion
In conclusion, sockets for ICs, transistors are increasingly popular in a variety of applications. PGA sockets offer numerous advantages over traditional IC packaging technologies, including high pin density, small size, and low power consumption. Moreover, they provide flexible and cost-effective solutions that provide reliable and repeatable connection to compatible ICs.
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